共 50 条
- [13] V-Band Planar Helical Antenna using TGSV Technology 2018 INTERNATIONAL SYMPOSIUM ON ANTENNAS AND PROPAGATION (ISAP), 2018,
- [14] Packaging properties of ALIVH-CSP using SBB flip-chip bonding technology IEEE TRANSACTIONS ON ADVANCED PACKAGING, 1999, 22 (03): : 366 - 371
- [15] Packaging properties of ALIVH-CSP using SBB flip-chip bonding technology IEEE Trans. Adv. Packag., 3 (366-371):
- [16] Packaging properties of ALIVH-CSP using SBB flip-chip bonding technology 1998 INTERNATIONAL CONFERENCE ON MULTICHIP MODULES AND HIGH DENSITY PACKAGING, PROCEEDINGS, 1998, : 236 - 241
- [19] A millimeter-wave flip-chip IC using micro-bump bonding technology 1996 IEEE INTERNATIONAL SOLID-STATE CIRCUITS CONFERENCE, DIGEST OF TECHNICAL PAPERS, 1996, 39 : 408 - 409
- [20] Cu-Cu Direct Bonding Technology Using Ultrasonic Vibration for Flip-chip Interconnection 2015 INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING AND IMAPS ALL ASIA CONFERENCE (ICEP-IAAC), 2015, : 468 - 472