V-band planar Gunn Oscillators and VCOs on AlN substrates using flip-chip bonding technology

被引:0
|
作者
Watanabe, K [1 ]
Deguchi, T [1 ]
Nakagawa, A [1 ]
机构
[1] New Japan Radio Co Ltd, Res & Dev Headquarters, Kamifukuoka, Saitama 3568510, Japan
关键词
D O I
暂无
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
This paper presents the development of V-band planar Gunn Oscillators using novel flip-chip GaAs Gunn diodes mounted on aluminum nitride (AIN) substrates. Due to using flip-chip bonding technology and unpackaged Gunn diodes, the Gunn Oscillator can be expected to realize low-cost mass production. The Gunn Oscillator generates an output power of 63.1mW at 58.73GHz with 2.57% conversion efficiency. An excellent phase noise of 87.67dBc/Hz at 100kHz off carrier has been achieved A varactor tunable Gunn VCO with a tuning range of 450MHz is also demonstrated.
引用
收藏
页码:13 / 16
页数:4
相关论文
共 50 条
  • [11] A V-band beam-steering antenna on a thin-film substrate with a flip-chip interconnection
    Lee, Sanghyo
    Song, Sangsub
    Kim, Youngmin
    Lee, Jangsoo
    Cheon, Chang-Yul
    Seo, Kwang-Seok
    Kwon, Youngwoo
    IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS, 2008, 18 (04) : 287 - 289
  • [12] V-Band Flip-Chip Assembled Gain Block Using In0.6Ga0.4As Metamorphic High-Electron-Mobility Transistor Technology
    Chiang, Che-Yang
    Hsu, Heng-Tung
    Wang, Chin-Te
    Kuo, Chien-I
    Hsu, Heng-Shou
    Chang, Edward Yi
    APPLIED PHYSICS EXPRESS, 2011, 4 (10)
  • [13] V-Band Planar Helical Antenna using TGSV Technology
    Naqvi, Aqeel Hussain
    Park, Jeong Heum
    Baek, Chang-Wook
    Lim, Sungjoon
    2018 INTERNATIONAL SYMPOSIUM ON ANTENNAS AND PROPAGATION (ISAP), 2018,
  • [14] Packaging properties of ALIVH-CSP using SBB flip-chip bonding technology
    Itagaki, M
    Amami, K
    Tomura, Y
    Yuhaku, S
    Ishimaru, Y
    Bessho, Y
    Eda, K
    Ishida, T
    IEEE TRANSACTIONS ON ADVANCED PACKAGING, 1999, 22 (03): : 366 - 371
  • [15] Packaging properties of ALIVH-CSP using SBB flip-chip bonding technology
    Matsushita Electric Industrial Co, Ltd, Osaka, Japan
    IEEE Trans. Adv. Packag., 3 (366-371):
  • [16] Packaging properties of ALIVH-CSP using SBB flip-chip bonding technology
    Itagaki, M
    Amami, K
    Tomura, Y
    Yuhaku, S
    Noda, O
    Bessho, Y
    Eda, K
    Ishida, T
    1998 INTERNATIONAL CONFERENCE ON MULTICHIP MODULES AND HIGH DENSITY PACKAGING, PROCEEDINGS, 1998, : 236 - 241
  • [17] Increasing the bonding strength of chips on flex substrates using thermosonic flip-chip bonding process with nonconductive paste
    Chuang, Cheng-Li
    Liao, Qing-An
    Li, Hsun-Tien
    Liao, Shi-Jie
    Huang, Guo-Shing
    MICROELECTRONIC ENGINEERING, 2010, 87 (04) : 624 - 630
  • [18] Novel flip-chip bonding technology for W-band interconnections using alternate lead-free solder bumps
    Onodera, K
    Ishii, T
    Aoyama, S
    Sugitani, S
    Tokumitsu, M
    IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS, 2002, 12 (10) : 372 - 374
  • [19] A millimeter-wave flip-chip IC using micro-bump bonding technology
    Sakai, H
    Ota, Y
    Inoue, K
    Yanagihara, M
    Matsuno, T
    Tanabe, M
    Yoshida, T
    Ikeda, Y
    Fujita, S
    Takahashi, K
    Sagawa, M
    1996 IEEE INTERNATIONAL SOLID-STATE CIRCUITS CONFERENCE, DIGEST OF TECHNICAL PAPERS, 1996, 39 : 408 - 409
  • [20] Cu-Cu Direct Bonding Technology Using Ultrasonic Vibration for Flip-chip Interconnection
    Arai, Yoshiyuki
    Nimura, Masatsugu
    Tomokage, Hajime
    2015 INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING AND IMAPS ALL ASIA CONFERENCE (ICEP-IAAC), 2015, : 468 - 472