Transient liquid phase bonding of aluminum using aluminum base interlayer under argon flux

An aluminum base interlayer was used for transient liquid phase bonding of pure aluminum under argon flux. The bonding was carried out at 595 degrees C for 2 minutes under 7MPa. Microstructure of the joint was studied with SEM and EDX, and the mechanical properties were analyzed by tensile test and bending test. A homogenous bonding zone is observed in the joint. The defects in the joint are silicon oxides and voids. The tensile strength of the joint is 190MPa, and no failure occurs when the joint is bent to 180 degrees. This indicates that TLP bonding can produce a strong and ductile Aluminum joint, which is equivalent to the base metal.