Suppressing Intermetallic Compound Growth in SnAgCu Solder Joints with Addition of Carbon Nanotubes

被引：7
|
作者：
Nai, S. M. L. [1 ]
Gupta, M. [1 ]
Wei, J. [2 ]
机构：
[1] Natl Univ Singapore, Dept Mech Engn, 9 Engn Dr 1, Singapore 117576, Singapore
[2] Singapore Inst Mfg Technol, Singapore 638075SININ, Singapore
来源：
2008 2ND IEEE INTERNATIONAL NANOELECTRONICS CONFERENCE, VOLS 1-3 | 2008年
关键词：
D O I：
10.1109/INEC.2008.4585428
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
In the present study, multi-walled carbon nanotubes (CNTs) were incorporated into SnAgCu solder matrix, to form composite solders. Isothermal aging study was performed on solder joints, to investigate the formation and growth of the intermetallic compound, (IMC) layer at the solder/metallization interface. Results revealed that rafter soldering, the initial interfacial IMC thickness of the unreinforced solder joint was comparable to that of the composite. solder joints. However, after aging, the interfacial IMC layer of the unreinforced solder joint was observed to grow more significantly than that of the composite solder joints. Furthermore, the composite solder joints exhibited lower diffusion coefficient and this indicated that the presence of CNTs was effective in retarding the growth of the IMC layer.
引用
收藏
页码：15 / +
页数：3
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