RESEARCH ON THE PACKAGING RELIABILITY AND DEGRADATION MODELS OF QUALITY FACTORS FOR A HIGH VACUUM SEALED MEMS GYROSCOPE

被引：0
|
作者：
He, C. H. [1 ,2 ,3 ]
Wang, Y. P. [1 ]
Huang, Q. W. [2 ]
Zhao, Q. C. [1 ]
Yang, Z. C. [1 ]
Zhang, D. C. [1 ]
Yan, G. Z. [1 ]
机构：
[1] Peking Univ, Inst Microelect, Natl Key Lab Sci & Technol Micro Nano Fabricat, Beijing 100871, Peoples R China
[2] Minist Ind & Informat Technol, Elect Res Inst 5, Sci & Technol Reliabil Phys & Applicat Elect Comp, Guangzhou 510610, Guangdong, Peoples R China
[3] Midea Grp Co Ltd, Foshan 528311, Guangdong, Peoples R China
来源：
2017 19TH INTERNATIONAL CONFERENCE ON SOLID-STATE SENSORS, ACTUATORS AND MICROSYSTEMS (TRANSDUCERS) | 2017年
基金：
中国国家自然科学基金;
关键词：
MEMS gyroscope; scale factor; packaging reliability; high vacuum sealed; degradation model;
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
This paper proposes a novel evaluation method for MEMS gyroscopes' packaging reliability. Based on the principles of thermodynamics and hydromechanics, the relationships among quality factors, air pressure, and gas number, as well as degradation models of them, are deducted for the first time. Experimental tests demonstrate that the relationships between the reciprocals of the two-mode quality factors and air pressure are approximately piecewise linear. Besides, the relationships between the reciprocals of quality factors and accelerated aging time are exponential, which accord with the theoretical analysis.
引用
收藏
页码：1077 / 1080
页数：4
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