Anisotropy in wetting of oriented sapphire surfaces by liquid Al-Cu alloys

The coexistence of a liquid with a solid and a gas phase causes a contact angle at the triple line and results in a certain work of adhesion. These properties were studied for liquid Al, Cu, and their alloys on single-crystalline sapphire surfaces with C(0001)-, A(11-20)-, and R(1-102)- orientation. Measurements were performed at 1100 A degrees C and under Ar atmosphere in a sessile drop apparatus. There, the sample was heated and melted separately from the substrate within a drop dispenser. Only after the desired measurement conditions were reached, the liquid metal was released. Depending on the alloy composition, the wetting angle approached a constant value within few minutes after the contact of droplet and substrate was established: For pure Cu the contact angle increased to an equilibrium value of 116A degrees A A +/- A 5A degrees, which is identical for all the studied sapphire surfaces. For pure Al an anisotropy of the contact angle with regard to these surfaces is found: time evolution of the Al contact angle is only observed for wetting of C-surfaces. Wetting of A- and R-surfaces shows no pronounced time dependence. In these cases, a smaller contact angle of about 90A degrees is observed. Wetting of the different sapphire surfaces by Al-Cu alloys corresponds qualitatively to their wetting by pure Al: again, only for C-surfaces a time-dependent increase of the contact angle is observed. On A- and R-surfaces wetting is not time-dependent and the contact angle increases with Cu content of the alloy.