Preparation of large Cu3Sn single crystal by Czochralski method

被引：0

作者：

Kong, Minsik ^{[1
]}

Park, Sang-Eon ^{[2
,3
]}

Kim, Hye Jung ^{[1
]}

Song, Sehwan ^{[1
]}

Ryu, Dong-Choon ^{[4
,5
]}

Kang, Baekjune ^{[6
]}

Sohn, Changhee ^{[6
]}

Kim, Hyun Jung ^{[2
]}

Kim, Youngwook ^{[7
]}

Yoon, Sangmoon ^{[8
]}

Go, Ara ^{[9
]}

Jeen, Hyoungjeen ^{[1
]}

Park, Sungkyun ^{[1
]}

Jeong, Se-Young ^{[10
,11
]}

Kang, Chang-Jong ^{[4
]}

Ok, Jong Mok ^{[1
]}

机构：

[1] Pusan Natl Univ, Dept Phys, Busan 46241, South Korea

[2] Pusan Natl Univ, Quantum Matter Core Facil, Busan 46241, South Korea

[3] Pusan Natl Univ, Crystal Bank Res Inst, Busan 46241, South Korea

[4] Chungnam Natl Univ, Dept Phys, Daejeon 34134, South Korea

[5] Kunsan Natl Univ, Dept Phys, Gunsan 54150, South Korea

[6] Ulsan Natl Inst Sci & Technol, Dept Phys, Ulsan 44919, South Korea

[7] DGIST, Dept Phys & Chem, Daegu 42988, South Korea

[8] Gachon Univ, Dept Phys, Seongnam 13120, South Korea

[9] Chonnam Natl Univ, Dept Phys, Gwangju 61186, South Korea

[10] Pusan Natl Univ, Dept Cognomechatron Engn, Busan 46241, South Korea

[11] Pusan Natl Univ, Dept Opt & Mechatron Engn, Busan 46241, South Korea

来源：

JOURNAL OF THE KOREAN PHYSICAL SOCIETY | 2022年 / 81卷 / 07期

关键词：

Single crystal; Czochralski; Intermetallic; Cu3Sn; LARGE MAGNETORESISTANCE; PHASE;

D O I：

10.1007/s40042-022-00589-6

中图分类号：

O4 [物理学];

学科分类号：

0702 ;

摘要：

Cu3Sn was recently predicted to host topological Dirac fermions, but related research is still in its infancy. The growth of large and high-quality Cu3Sn single crystals is, therefore, highly desired to investigate the possible topological properties. In this work, we report the single crystal growth of Cu3Sn by Czochralski (CZ) method. Crystal structure, chemical composition, and transport properties of Cu3Sn single crystals were analyzed to verify the crystal quality. Notably, compared to the mm-sized crystals from a molten Sn flux, the cm-sized crystals obtained by the CZ method are free from contamination from flux materials, paving the way for the follow-up works.

引用

页码：658 / 663

页数：6

共 50 条

[31] Suppression of Cu3Sn in the Sn-10Cu peritectic alloy by the addition of Ni
Mehreen, Syeda U. (s.mehreen@uq.edu.au), 1600, Elsevier Ltd (766):
[32] Growth behavior and formation mechanism of porous Cu3Sn in Cu/Sn solder system
Lin, Ke
Ling, Huiqin
Hu, Anmin
Wu, Yunwen
Gao, Liming
Hang, Tao
Li, Ming
MATERIALS CHARACTERIZATION, 2021, 178
[33] Suppression of Cu3Sn in the Sn-10Cu peritectic alloy by the addition of Ni
Mehreen, Syeda U.
Nogita, Kazuhiro
McDonald, Stuart
Yasuda, Hideyuki
StJohn, David
JOURNAL OF ALLOYS AND COMPOUNDS, 2018, 766 : 1003 - 1013
[34] Preparation of a decagonal Al-Cu-Co single quasicrystal by the Czochralski method
Yokoyama, Y
Note, R
Yamaguchi, A
Inoue, A
Fukaura, K
Sunada, H
MATERIALS TRANSACTIONS JIM, 1999, 40 (02): : 123 - 131
[35] Preparation of a decagonal Al-Cu-Co single quasicrystal by the Czochralski method
Himeji Inst of Technology, Himeji, Japan
Mater Trans JIM, 2 (123-131):
[36] Effect of ni on the formation of Cu6Sn5 and Cu3Sn intermetallics
Yu, Hao
Vuorinen, Vesa
Kivilahti, Jonna
IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING, 2007, 30 (04): : 293 - 298
[37] TOPOLOGY ANALYSIS OF THE CU3SN PHASE IN ELECTRONIC INTERCONNECTIONS
Gao, Feng
Nishikawa, Hiroshi
Takemoto, Tadashi
CHARACTERIZATION AND CONTROL OF INTERFACES FOR HIGH QUALITY ADVANCED MATERIALS II, 2007, 198 : 401 - 406
[38] Acceleration of the growth of Cu3Sn voids in solder joints
Borgesen, Peter
Yin, Liang
Kondos, Pericles
MICROELECTRONICS RELIABILITY, 2012, 52 (06) : 1121 - 1127
[39] Growth behavior and formation mechanism of porous Cu3Sn in Cu/Sn solder system
Lin, Ke
Ling, Huiqin
Hu, Anmin
Wu, Yunwen
Gao, Liming
Hang, Tao
Li, Ming
Materials Characterization, 2021, 178
[40] Orientation-dependent transport properties of Cu3Sn
Daeumer, Matthias
Sandoval, Ernesto D.
Azizi, Arad
Bagheri, Morteza H.
Bae, In-Tae
Panta, Sitaram
Koulakova, Ekaterina A.
Cotts, Eric
Arvin, Charles L.
Kolmogorov, Aleksey N.
Schiffres, Scott N.
ACTA MATERIALIA, 2022, 227

← 1 2 3 4 5 →