The Effect of Functionalized Silver on Properties of Conductive Adhesives

被引：0
|
作者：
Fan, Qiong [1 ]
Cui, Huiwang [1 ]
Li, Dongsheng [1 ]
Hu, Zhili [1 ,3 ]
Yuan, Zhichao [2 ]
Ye, Lilei [3 ]
Liu, Johan [1 ,3 ]
机构：
[1] Shanghai Univ, Key Lab Adv Display & Syst Applicat, Minist Educ, Shanghai 200072, Peoples R China
[2] Shanghai Univ, Shang Da Rui Hu Microsyst Integrat Technol, Shanghai 200072, Peoples R China
[3] Chalmers Univ Technol, Dept Microtechnol & Nanosci, SMIT Ctr, SE-41296 Gothenburg, Sweden
来源：
2011 12TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY AND HIGH DENSITY PACKAGING (ICEPT-HDP) | 2011年
基金：
美国国家科学基金会;
关键词：
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
This research used low molecular surface modifiers and observed that chemisorptions took place through the formation of a bond between silver surface and an adsorbed molecule, which improved the dispersion of silver flakes in the organic resin. Results of shear viscosity, bulk resistivity etc. showed that by using these low molecular organic functionalizers, isotropic conductive adhesives (ICAs) with lower shear viscosity and better electrical conductivity at high silver fillers content were obtained. Different processing methods and different matrixes were compared.
引用
收藏
页码：423 / 425
页数：3
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