Electrowetting-induced capillary flow in a parallel-plate channel

被引:18
|
作者
Chen, JH [1 ]
Hsieh, WH [1 ]
机构
[1] Natl Chung Cheng Univ, Dept Mech Engn, Chiayi, Taiwan
关键词
electrowetting; dynamic contact angle; capillary flow;
D O I
10.1016/j.jcis.2005.08.048
中图分类号
O64 [物理化学(理论化学)、化学物理学];
学科分类号
070304 ; 081704 ;
摘要
This paper investigated, theoretically and experimentally, the electrowetting-induced capillary rise in a parallel-plate channel. The measured equilibrium height ofthe meniscus was proportional to the square of the applied potential. A model, based on the kinetic equation ofcapillary flow with the consideration of an electrowetting dynamic contact angle, was established to Simulate the capillary rise. The effects of the electrostatic charge and the contact-line friction were linearly added to describe the electrowetting dynamic contact angle. The model was found to be able to adequately describe the experimental data under different initial heights and applied voltages. The non-Poseuille flow effect had little influence in the meniscus rising phenomenon studied in this work. (c) 2005 Elsevier Inc. All rights reserved.
引用
收藏
页码:276 / 283
页数:8
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