Paper-Woven Circuits: Fabrication Approach for Papercraft-based Electronic Devices

被引:4
|
作者
Kato, Kunihiro [1 ]
Ikematsu, Kaori [2 ]
Igarashi, Yuki [3 ]
Kawahara, Yoshihiro [4 ]
机构
[1] Tokyo Univ Technol, Tokyo, Japan
[2] Yahoo Japan Corp, Tokyo, Japan
[3] Meiji Univ, Tokyo, Japan
[4] Univ Tokyo, Tokyo, Japan
来源
TEI'22: PROCEEDINGS OF THE SIXTEENTH INTERNATIONAL CONFERENCE ON TANGIBLE, EMBEDDED, AND EMBODIED INTERACTION | 2022年
关键词
Digital fabrication; paper electronics;
D O I
10.1145/3490149.3502253
中图分类号
TP3 [计算技术、计算机技术];
学科分类号
0812 ;
摘要
In this pictorial, we propose an approach to integrate electronics into a paper-woven craft. A paper-woven structure is formed by alternately and orthogonally weaving paper strips. The key idea is to add conductive layers to these strips by printing or transferring conductive materials. Our approach enables us to form the skeleton of an object and its wiring and sensor arrangement simultaneously. We explore the creative space of this approach, i.e., integrating functions such as sensing, display, and sound amplification into objects, for leveraging the paper-woven structure. We also outline the workflow of the approach, introduce a design support tool, and discuss example applications that combine the electronic-enabled functionality and woven structure.
引用
收藏
页数:11
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