Compact Thermal Modelling of Power LED Light Sources

被引：0
|
作者：
Torzewicz, T. [1 ]
Baran, K. [2 ]
Raszkowski, T. [1 ]
Samson, A. [1 ]
Wachta, H. [2 ]
Napieralski, A. [1 ]
机构：
[1] Lodz Univ Technol, Dept Microelect & Comp Sci, Ul Wolczanska 221-223, PL-90924 Lodz, Poland
[2] Rzeszow Univ Technol, Dept Power Elect & Engn, Al Powstancow Warszawy 12, PL-35959 Rzeszow, Poland
来源：
2017 IEEE 30TH INTERNATIONAL CONFERENCE ON MICROELECTRONICS (MIEL) | 2017年
关键词：
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
This paper discuses on the practical example the problem of thermal modelling of power LEDs used in luminaries. The proper determination of the thermal resistance is crucial for accurate computation of the device junction temperature, which determines the device operating parameters. here, this problem is illustrated based on the analysis of power LED heating curve measurements taken for various amount of power dissipated in the device, which is soldered to the substrate in different ways. For each case, a compact thermal model is generated employing the Network Identification by Deconvolution method.
引用
收藏
页码：157 / 160
页数：4
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