Reliability issues of e-Cubes heterogeneous system integration

被引：0
|
作者：
Janczyk, Grzegorz [1 ]
Bieniek, Tomasz [2 ]
Szynka, Jerzy [1 ]
Grabiec, Piotr [2 ]
机构：
[1] Inst Electr Mat Technol, Dept Integrated Circuits & Syst, PL-02668 Warsaw, Poland
[2] Inst Electr Mat Technol, Div Silicon Microsyst & Nanostruct Technol, PL-02668 Warsaw, Poland
来源：
MICROELECTRONICS RELIABILITY | 2008年 / 48卷 / 8-9期
关键词：
Data transfer;
D O I：
10.1016/j.microrel.2008.06.023
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
The fast development of device fabrication technology stimulates new challenging technology development and progress in wafer processing, module interconnections and packaging technology. Apart from a broad hardware experience, standalone software design simulations before a hardware fabrication are a necessity. This paper discusses software issues of the design and an experimental attempt to the device description and the device description data transfer. (c) 2008 Elsevier Ltd. All rights reserved.
引用
收藏
页码：1133 / 1138
页数：6
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