Hot Embossing Process Technology Forming Arbitrary Patterns in Real Time

被引:3
|
作者
Kim, Myeongjin [1 ]
Ahn, Jaewon [1 ]
Kim, Donghyun [1 ]
Bae, Junseong [1 ]
Yun, Dongwon [1 ]
机构
[1] Daegu Gyeongbuk Inst Sci & Technol DGIST, Dept Robot Engn, 333 Techno Jungang Daero, Dalseong Gun 42988, Daegu, South Korea
来源
ADVANCED MATERIALS TECHNOLOGIES | 2020年 / 5卷 / 11期
关键词
hot embossing; impact headers; multiheaders; patterning algorithm; user-defined patterning; BIOSENSORS; SENSORS;
D O I
10.1002/admt.202000459
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
With the development of mobile sensors and biosensors, an ultrafine process technology that can generate ultrafine patterns and has mass production capability has garnered attention recently. Unlike the existing hot embossing techniques, the impact print-type hot embossing process can generate a microscale pattern that has arbitrary pattern width and depth on a polymer film in real time using a single impact header. For this reason, this process can be applied to various industrial fields that require ultrafine patterns. However, it cannot create intricate patterns due to the limitations of the two-axis stage control system. Furthermore, its application to a mass production that requires pattern repetition is limited because of the single header system. In this paper, a three-axis impact print-type hot embossing system using a multiheader and two algorithms, the impacting coordinate-based data extraction algorithm and independent driving algorithm, to overcome the limitations of previous systems is proposed. Thanks to the multiheader and control algorithm, this process can generate repetitive patterns in real time, and it can adjust the pattern resolution by controlling the pattern extraction interval. The proposed method is thus expected to be widely applicable to industrial fields that require microscale user-defined patterns such as mobile sensors and biosensors.
引用
收藏
页数:13
相关论文
共 50 条
  • [21] Monitoring Arbitrary Activation Patterns in Real-Time Systems
    Neukirchner, Moritz
    Michaels, Tobias
    Axer, Philip
    Quinton, Sophie
    Ernst, Rolf
    PROCEEDINGS OF THE 2012 IEEE 33RD REAL-TIME SYSTEMS SYMPOSIUM (RTSS), 2012, : 293 - 302
  • [22] Modeling the Embossing Stage of the Ultrasonic-Vibration-Assisted Hot Glass Embossing Process
    Nguyen, Lan Phuong
    Hao, Kei-Chon
    Su, Yi-Hsiang
    Hung, Chinghua
    INTERNATIONAL JOURNAL OF APPLIED GLASS SCIENCE, 2015, 6 (02) : 172 - 181
  • [23] Experimental analysis and numerical modelling of the forming process of polypropylene replicas of micro-cavities using hot embossing
    Mohamed Sahli
    Christine Millot
    Claude Roques-Carmes
    Chantal Khan Malek
    Microsystem Technologies, 2009, 15 : 827 - 835
  • [24] Micro/nano patterning characteristics in hot embossing process
    Kim, HY
    Kim, KS
    Kim, BH
    MATERIALS PROCESSING AND DESIGN: MODELING, SIMULATION AND APPLICATIONS, PTS 1 AND 2, 2004, 712 : 1470 - 1475
  • [25] Experimental analysis and numerical modelling of the forming process of polypropylene replicas of micro-cavities using hot embossing
    Sahli, Mohamed
    Millot, Christine
    Roques-Carmes, Claude
    Malek, Chantal Khan
    MICROSYSTEM TECHNOLOGIES-MICRO-AND NANOSYSTEMS-INFORMATION STORAGE AND PROCESSING SYSTEMS, 2009, 15 (06): : 827 - 835
  • [26] Material Modeling of PMMA Film for Hot Embossing Process
    Yun, Dongwon
    Kim, Jong-Bong
    POLYMERS, 2021, 13 (19)
  • [27] Heat generation and distribution in the ultrasonic hot embossing process
    Kosloh, J.
    Sackmann, J.
    Sakalys, R.
    Liao, S.
    Gerhardy, C.
    Schomburg, W. K.
    MICROSYSTEM TECHNOLOGIES-MICRO-AND NANOSYSTEMS-INFORMATION STORAGE AND PROCESSING SYSTEMS, 2017, 23 (05): : 1411 - 1421
  • [28] Microlenses array fabrication by hot embossing process.
    Lee, HS
    Lee, SK
    Kwon, TH
    Lee, SS
    2002 IEEE/LEOS INTERNATIONAL CONFERENCE ON OPTICAL MEMS, CONFERENCE DIGEST, 2002, : 73 - 74
  • [29] Analysis of pattern height development in hot embossing process
    He, Yong
    Fu, Jian-Zhong
    Chen, Zi-Chen
    MICROSYSTEM TECHNOLOGIES-MICRO-AND NANOSYSTEMS-INFORMATION STORAGE AND PROCESSING SYSTEMS, 2009, 15 (07): : 963 - 968
  • [30] Analysis of pattern height development in hot embossing process
    Yong He
    Jian-Zhong Fu
    Zi-Chen Chen
    Microsystem Technologies, 2009, 15 : 963 - 968