Rheological effect on screen-printed morphology of thick film silver paste metallization

被引:22
|
作者
Zhou, Yingying [1 ]
Tong, Hua [1 ]
Liu, Yujie [2 ]
Yuan, Shuanglong [1 ]
Yuan, Xiao [1 ]
Liu, Cui [1 ]
Zhang, Yuancheng [2 ]
Chen, Guorong [1 ]
Yang, Yunxia [1 ]
机构
[1] East China Univ Sci & Technol, Sch Mat Sci & Engn, Key Lab Ultrafine Mat, Minist Educ, Shanghai 200237, Peoples R China
[2] Shanghai Solar Energy Res Ctr Co, Shanghai 200241, Peoples R China
关键词
WALL SLIP; CONCENTRATED SUSPENSIONS; POLYMER-SOLUTIONS; APPARENT SLIP; VISCOMETERS; FLOW;
D O I
10.1007/s10854-016-6219-1
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Up to now the topography of thick film silver paste metallization is still a great challenge to the crystalline silicon solar cell manufacturers due to lack of overall understanding about the dependence of screen-printed morphology on paste rheology. In this article, we demonstrate that both the shear thixotropy and wall slip are primary rheological behaviors of pastes affecting screen-printed morphology. By comparison among three different commercial pastes, the association of screen-printed morphology with apparent viscosity and slip velocity of pastes were investigated. The results from printing finger lines with designed width of 45 mu m show clearly that the widening degree of lines is associated with the paste viscosity, and the height and cross-sectional profile of lines mainly rely on the wall slip velocity of paste passing through screen meshes. Briefly, the lower the apparent viscosity, the wider the lines; and the greater the wall slip velocity, the less the line height and more likely the formation of trapezoidal cross-sectional profile with larger area. Our study shows for the first time that the wall slip of pastes may produce significant influence on cell efficiency, since its influence on screen-printed morphology is considerably remarkable and vital.
引用
收藏
页码:5548 / 5553
页数:6
相关论文
共 50 条
  • [41] The effect on performance of fabrication parameter variations of thick-film screen printed silver/silver chloride potentiometric reference electrodes
    Glanc, M.
    Sophocleous, M.
    Atkinson, J. K.
    Garcia-Breijo, E.
    SENSORS AND ACTUATORS A-PHYSICAL, 2013, 197 : 1 - 8
  • [42] Mandrel Bend Test of Screen-Printed Silver Conductors
    Chen, Rui
    Chow, Justin
    Zhou, Yi
    Sitaraman, Suresh K.
    JOURNAL OF ELECTRONIC PACKAGING, 2023, 145 (03)
  • [43] Modeling the effect of surface roughness for screen-printed silver ink on flexible substrates
    Abdelatty, Mohamed Y.
    Umar, Ashraf
    Khinda, Gurvinder S.
    Alhendi, Mohammed
    Poliks, Mark D.
    IEEE 72ND ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2022), 2022, : 1946 - 1951
  • [44] Enhancing Adhesion of Screen-Printed Silver Nanopaste Films
    Kim, Jae-Han
    Kim, Kwang-Seok
    Jang, Kyung-Rim
    Jung, Seung-Boo
    Kim, Taek-Soo
    ADVANCED MATERIALS INTERFACES, 2015, 2 (13):
  • [45] Dielectric permittivity and loss of hydroxyapatite screen-printed thick films
    Silva, CC
    Almeida, AFL
    De Oliveira, RS
    Pinheiro, AG
    Góes, JC
    Sombra, ASB
    JOURNAL OF MATERIALS SCIENCE, 2003, 38 (18) : 3713 - 3720
  • [46] Screen-printed gold thick films for electrochemical sensor applications
    Rabbow, T. J.
    Junker, N.
    Schneider, M.
    Michaelis, A.
    MATERIALWISSENSCHAFT UND WERKSTOFFTECHNIK, 2011, 42 (09) : 777 - 783
  • [47] Sintering of screen-printed platinum thick films for electrode applications
    Véchembre, JB
    Fox, GR
    JOURNAL OF MATERIALS RESEARCH, 2001, 16 (04) : 922 - 931
  • [48] Electrochemically Induced Degradation of Screen-Printed Gold Thick Films
    Rabbow, T. J.
    Junker, N.
    Kretzschmar, C.
    Schneider, M.
    Michaelis, A.
    JOURNAL OF CERAMIC SCIENCE AND TECHNOLOGY, 2012, 3 (04): : 199 - 209
  • [49] Screen printed nanosized ZnO thick film
    Bindu Krishnan
    V. P. N. Nampoori
    Bulletin of Materials Science, 2005, 28 : 239 - 242
  • [50] Screen printed nanosized ZnO thick film
    Krishnan, B
    Nampoori, VPN
    BULLETIN OF MATERIALS SCIENCE, 2005, 28 (03) : 239 - 242