Analysis of Crosstalk Delay using Mixed CNT Bundle based Through Silicon Vias

被引：0
|
作者：
Majumder, Manoj Kumar [1 ]
Kumari, Archana [1 ]
Kaushik, B. K. [1 ]
Manhas, S. K. [1 ]
机构：
[1] Indian Inst Technol Roorkee, Roorkee 247667, Uttarakhand, India
来源：
2014 IEEE RADIO FREQUENCY INTEGRATED CIRCUITS SYMPOSIUM | 2014年
关键词：
Carbon nanotube (CNT); mixed CNT bundle (MCB); through silicon vias (TSVs); crosstalk; delay; nanotechnology; CARBON NANOTUBES; PERFORMANCE ANALYSIS;
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
This research paper presents a new method to reduce crosstalk of carbon nanotube (CNT) bundle based through silicon vias (TSVs). For this, a unique structure of mixed CNT bundled (MCB) TSV is proposed with specific arrangement of single-(SWCNT) and multi-walled CNTs (MWCNTs). An equivalent electrical model is presented for different MCB configurations wherein MWCNTs are placed at peripheral layers to the centrally located SWCNTs. A significant reduction in crosstalk induced delay is observed for higher number of peripheral layers containing MWCNTs. For different TSV heights, the overall reduction in crosstalk induced delay is 44.03% using novel MCB instead of conventional SWCNT bundle.
引用
收藏
页码：441 / 444
页数：4
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