Hybrid Superlattice Coolers for Dynamic Thermal Management of Microprocessor Hotspots

被引：0
|
作者：
Sahu, Vivek [1 ]
Joshi, Yogendra K. [1 ]
Fedorov, Andrei G. [1 ]
机构：
[1] Georgia Inst Technol, George W Woodruff Sch Mech Engn, Atlanta, GA 30332 USA
来源：
PROCEEDINGS OF THE ASME INTERNATIONAL HEAT TRANSFER CONFERENCE - 2010 , VOL 3: COMBUSTION, CONDUCTION, ELECTRONIC COOLING, EVAPORATION,TWO-PHASE FLOW | 2010年
关键词：
Dynamic thermal management; superlattice cooler; hotspots; microchannel heat sink;
D O I：
暂无
中图分类号：
O414.1 [热力学];
学科分类号：
摘要：
A hybrid cooling scheme for thermal management of hotspots (300-500 W/cm(2)) in the presence of low background heat flux (100 W/cm(2) over 1 cm(2)) is being investigated. It uses superlattice coolers (SLCs) to remove ultra high power density hotspot and microchannel heat sink for lower background heat flux. In this paper, transient response of the SLC for hotspot removal is studied. The effect of contact resistance, chip thickness, and hotspot size on the performance of the hybrid cooling scheme is also investigated.
引用
收藏
页码：681 / 687
页数：7
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