Hybrid Superlattice Coolers for Dynamic Thermal Management of Microprocessor Hotspots

被引：0
|
作者：
Sahu, Vivek [1 ]
Joshi, Yogendra K. [1 ]
Fedorov, Andrei G. [1 ]
机构：
[1] Georgia Inst Technol, George W Woodruff Sch Mech Engn, Atlanta, GA 30332 USA
来源：
PROCEEDINGS OF THE ASME INTERNATIONAL HEAT TRANSFER CONFERENCE - 2010 , VOL 3: COMBUSTION, CONDUCTION, ELECTRONIC COOLING, EVAPORATION,TWO-PHASE FLOW | 2010年
关键词：
Dynamic thermal management; superlattice cooler; hotspots; microchannel heat sink;
D O I：
暂无
中图分类号：
O414.1 [热力学];
学科分类号：
摘要：
A hybrid cooling scheme for thermal management of hotspots (300-500 W/cm(2)) in the presence of low background heat flux (100 W/cm(2) over 1 cm(2)) is being investigated. It uses superlattice coolers (SLCs) to remove ultra high power density hotspot and microchannel heat sink for lower background heat flux. In this paper, transient response of the SLC for hotspot removal is studied. The effect of contact resistance, chip thickness, and hotspot size on the performance of the hybrid cooling scheme is also investigated.
引用
收藏
页码：681 / 687
页数：7
相关论文
共 50 条
  • [1] Transient Characterization of Hybrid Microfluidic-Thermoelectric Cooling Scheme for Dynamic Thermal Management of Microprocessor
    Sahu, Vivek
    Fedorov, Andrei G.
    Joshi, Yogendra K.
    JOURNAL OF ELECTRONIC PACKAGING, 2014, 136 (03)
  • [2] Computational and Experimental Investigation of Thermal Coupling Between Superlattice Coolers
    Sahu, Vivek
    Fedorov, Andrei G.
    Joshi, Yogendra K.
    IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2014, 4 (04): : 622 - 631
  • [3] OctaLynx D: RISC Microprocessor Dedicated for Dynamic Thermal Management
    Frankiewicz, Maciej
    Gal, Ryszard
    Golda, Adam
    Kos, Andrzej
    MIXED DESIGN OF INTEGRATED CIRCUITS AND SYSTEMS, MIXDES 2013, 2013, : 259 - 262
  • [4] Hybrid architectural dynamic thermal management
    Skadron, K
    DESIGN, AUTOMATION AND TEST IN EUROPE CONFERENCE AND EXHIBITION, VOLS 1 AND 2, PROCEEDINGS, 2004, : 10 - 15
  • [5] Generalized thermal analysis of hotspots on a high power density microprocessor chip
    Xiu, K
    Ketchen, M
    55TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, VOLS 1 AND 2, 2005 PROCEEDINGS, 2005, : 1016 - 1020
  • [6] THERMOELECTRIC COOLERS FOR THERMAL GRADIENT MANAGEMENT ON CHIP
    Sullivan, Owen
    Gupta, Man Prakash
    Mukhopadhyay, Saibal
    Kumar, Satish
    PROCEEDINGS OF THE ASME INTERNATIONAL MECHANICAL ENGINEERING CONGRESS AND EXPOSITION 2010, VOL 4, 2012, : 199 - +
  • [7] Fuel cell thermal management with thermoelectric coolers
    Parise, RJ
    Jones, GF
    2002 37TH INTERSOCIETY ENERGY CONVERSION ENGINEERING CONFERENCE (IECEC), 2002, : 607 - 614
  • [8] Thermal management of power electronics using thermoelectric coolers
    Vandersande, JW
    Fleurial, JP
    PROCEEDINGS ICT '96 - FIFTEENTH INTERNATIONAL CONFERENCE ON THERMOELECTRICS, 1996, : 252 - 255
  • [9] Thermal management of a medical device using thermoelectric coolers
    Wang, KY
    TWENTIETH ANNUAL IEEE SEMICONDUCTOR THERMAL MEASUREMENT AND MANAGEMENT SYMPOSIUM, PROCEEDINGS 2004, 2004, : 122 - 124
  • [10] Array of Thermoelectric Coolers for On-Chip Thermal Management
    Sullivan, Owen
    Gupta, Man Prakash
    Mukhopadhyay, Saibal
    Kumar, Satish
    JOURNAL OF ELECTRONIC PACKAGING, 2012, 134 (02)
12345