Implementation of GaAs monolithic microwave integrated circuits with on-chip BST capacitors

被引:10
|
作者
Ueda, D [1 ]
机构
[1] Matsushita Elect Corp, Elect Res Lab, Takatsuki, Osaka 569, Japan
关键词
BST; GaAs; MMIC; MOD;
D O I
10.1023/A:1009975108330
中图分类号
TQ174 [陶瓷工业]; TB3 [工程材料学];
学科分类号
0805 ; 080502 ;
摘要
GaAs microwave monolithic ICs with novel on-chip BST (BaxSr1-xTiO3) capacitors are demonstrated. MOD (Metal Organic Decomposition) technique was employed to make the BST thin film. The fabricated BST capacitor has the dielectric constant as high as 300, which is 50 times higher than the conventional Si3N4 one. The implemented GaAs MMIC with on-chip BST capacitor provides both high gain and low power dissipation characteristics. These MMIC can be packaged in a compact outline with reduced pin counts. BST capacitors also show the suppressed harmonics due to their low-pass filtering characteristics of the frequency roll-off around 2 GHz. The present technology will reduce the system size for a variety of the mobile communication systems.
引用
收藏
页码:105 / 113
页数:9
相关论文
共 50 条
  • [21] MONOLITHIC MICROWAVE INTEGRATED-CIRCUITS
    WILSON, K
    GEC JOURNAL OF RESEARCH, 1986, 4 (02): : 140 - 146
  • [22] GAAS INTEGRATED MICROWAVE CIRCUITS
    MEHAL, EW
    WACKER, RW
    IEEE TRANSACTIONS ON ELECTRON DEVICES, 1968, ED15 (07) : 513 - &
  • [23] GAAS INTEGRATED MICROWAVE CIRCUITS
    MEHAL, EW
    WACKER, RW
    IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, 1968, MT16 (07) : 451 - &
  • [24] GAAS INTEGRATED MICROWAVE CIRCUITS
    MEHAL, EW
    WACKER, RW
    IEEE JOURNAL OF SOLID-STATE CIRCUITS, 1968, SC 3 (02) : 113 - &
  • [25] DESIGN METHOD OF MONOLITHIC MICROWAVE CIRCUITS ON GAAS
    DUEME, P
    APERCE, G
    ONDE ELECTRIQUE, 1989, 69 (02): : 22 - 28
  • [26] On-chip sampling in CMOS integrated circuits
    Delmas-Bendhia, S
    Caignet, F
    Sicard, E
    Roca, M
    IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, 1999, 41 (04) : 403 - 406
  • [27] PLASMA NITRIDE ON-CHIP CAPACITORS FOR GAAS IC FABRICATION
    ODEKIRK, B
    SHEETS, J
    JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1985, 132 (08) : C350 - C350
  • [28] Design, Analysis and Validation of MCP Package for GaAs Monolithic Microwave Integrated Circuits Packaging
    Gugulothu, Ravi
    Bhalke, Sangam
    Lalkishore, K.
    Dasari, Ramakrishna
    IETE JOURNAL OF RESEARCH, 2023, 69 (11) : 8293 - 8306
  • [29] DRY ETCHING OF VIA CONNECTIONS FOR GAAS MONOLITHIC MICROWAVE INTEGRATED-CIRCUITS FABRICATION
    SALIMIAN, S
    COOPER, CB
    DAY, ME
    JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B, 1987, 5 (06): : 1606 - 1610
  • [30] PROCESS-INDUCED DEFECTS IN MANUFACTURE OF GAAS MONOLITHIC MICROWAVE INTEGRATED-CIRCUITS
    PUROHIT, RK
    DUBEY, GC
    DAYAL, S
    GULATI, R
    BALAKRISHNAN, VR
    RAO, K
    SREEDHAR, AK
    MATERIALS SCIENCE AND ENGINEERING B-SOLID STATE MATERIALS FOR ADVANCED TECHNOLOGY, 1994, 28 (1-3): : 268 - 271