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Foreword
被引:219
|作者:
Chen, Sinn-wen
[1
,9
]
Chada, Srinivas
[2
]
Chen, Chih-ming
[3
,10
]
Flandorfer, Hans
[4
,11
]
Lindsay Greer, A.
[5
,12
]
Lee, Jae-Ho
[6
,13
]
Zeng, Kejun
[7
,14
]
Suganuma, Katsuaki
[8
,15
]
机构:
[1] Natl Tsing Hua Univ, Hsinchu, Taiwan
[2] Medtron Microelectron, Tempe, AZ USA
[3] Natl Chung Hsing Univ, Taichung, Taiwan
[4] Univ Vienna, Vienna, Austria
[5] Univ Cambridge, Cambridge, England
[6] Hongik Univ, Seoul, South Korea
[7] Texas Instruments Inc, Dallas, TX USA
[8] Osaka Univ, Suita, Osaka, Japan
[9] Natl Tsing Hua Univ, Hsinchu, Taiwan
[10] Natl Chung Hsing Univ, Taichung, Taiwan
[11] Univ Vienna, A-1010 Vienna, Austria
[12] Univ Cambridge, Cambridge CB2 1TN, England
[13] Hongik Univ, Seoul, South Korea
[14] Texas Instruments Inc, Dallas, TX 75265 USA
[15] Osaka Univ, Suita, Osaka 565, Japan
关键词:
D O I:
10.1007/s11664-008-0572-7
中图分类号:
TM [电工技术];
TN [电子技术、通信技术];
学科分类号:
0808 ;
0809 ;
摘要:
引用
收藏
页码:1 / 1
页数:1
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