Out-of-plane electrothermal actuators in silicon-on-insulator technology

被引:6
|
作者
Tsang, See-Ho [1 ]
Sameoto, Dan [1 ]
Parameswaran, M. [1 ]
机构
[1] Simon Fraser Univ, Inst Micromachine & Microfabricat Res, Sch Engn Sci, Burnaby, BC V5A 1S6, Canada
关键词
D O I
10.1109/CJECE.2006.259191
中图分类号
TP3 [计算技术、计算机技术];
学科分类号
0812 ;
摘要
A novel electrothermal micro-actuator capable of actuation after being rotated 90 degrees out of plane is presented. The actuator is fabricated and characterized using the Micragem silicon-on-insulator (SOI) process developed by Micralyne Inc. The actuator is designed to be rotated out of plane by means of a serpentine spring design that provides electrical contact to the substrate while applying a downward force to hold the actuator in place. The eventual purpose of this actuator is to adjust the position of a micromirror at a 90 degrees angle to the substrate. Tbe actuator performs as expected in the horizontal position and can be assembled using standard microprobes. The actuator performance and the theory of spring operation are presented using an analytical heat transfer model, finite element modelling, and device measurements.
引用
收藏
页码:97 / 103
页数:7
相关论文
共 50 条
  • [21] Parallel-beams/lever electrothermal out-of-plane actuator
    Deladi, S
    Krijnen, G
    Elwenspoek, MC
    DTIP 2003: DESIGN, TEST, INTEGRATION AND PACKAGING OF MEMS/MOEMS 2003, 2003, : 103 - 107
  • [22] Parallel-beams/lever electrothermal out-of-plane actuator
    S. Deladi
    G. Krijnen
    M.C. Elwenspoek
    Microsystem Technologies, 2004, 10 : 393 - 399
  • [23] A nodal analysis model for the out-of-plane beamshape electrothermal microactuator
    Rengang Li
    Qing-An Huang
    Weihua Li
    Microsystem Technologies, 2009, 15 : 217 - 225
  • [24] Parallel-beams/lever electrothermal out-of-plane actuator
    S. Deladi
    G. Krijnen
    M. C. Elwenspoek
    Microsystem Technologies, 2004, 10 (5) : 393 - 399
  • [25] A nodal analysis model for the out-of-plane beamshape electrothermal microactuator
    Li, Rengang
    Huang, Qing-An
    Li, Weihua
    MICROSYSTEM TECHNOLOGIES-MICRO-AND NANOSYSTEMS-INFORMATION STORAGE AND PROCESSING SYSTEMS, 2009, 15 (02): : 217 - 225
  • [26] WAFER BONDING TECHNIQUE FOR SILICON-ON-INSULATOR TECHNOLOGY
    ABE, T
    MATLOCK, JH
    SOLID STATE TECHNOLOGY, 1990, 33 (11) : 39 - 40
  • [27] A low-power-consumption out-of-plane electrothermal actuator
    Girbau, David
    Llamas, Marco Antonio
    Casals-Terre, Jasmina
    Simo-Selvas, Xavier
    Pradell, Lluis
    Lazaro, Antonio
    JOURNAL OF MICROELECTROMECHANICAL SYSTEMS, 2007, 16 (03) : 719 - 727
  • [28] SILICON-ON-INSULATOR TECHNOLOGY - ON A STEADY PATH TO MATURITY
    GOODENOUGH, F
    ELECTRONIC DESIGN, 1984, 32 (24) : 88 - &
  • [29] Model of Vernier devices in silicon-on-insulator technology
    Fan, Guofang
    Li, Yuan
    Hu, Chunguang
    Lei, Lihua
    Zhao, Dong
    Li, Hongyu
    Luo, Yunhan
    Zhen, Zhen
    INFRARED PHYSICS & TECHNOLOGY, 2014, 65 : 83 - 86
  • [30] In-plane photonic transduction of silicon-on-insulator microcantilevers
    Noh, Jong Wook
    Anderson, Ryan
    Kim, Seunghyun
    Cardenas, Jaime
    Nordin, Gregory P.
    OPTICS EXPRESS, 2008, 16 (16) : 12114 - 12123