Microwave dielectric properties and chemical compatibility with silver electrode of low-fired Li2Cu0.2Mg0.8Ti3O8 ceramic

被引:5
|
作者
Tang, Ying [1 ]
Fang, Liang [1 ]
Zhou, Huanfu [1 ]
Liu, Qinwen [1 ]
Zhang, Hui [1 ]
机构
[1] Guilin Univ Technol, State Key Lab Breeding Base Nonferrous Met & Spec, Key Lab Nonferrous Mat & New Proc Technol, Minist Educ,Coll Mat Sci & Engn, Guilin 541004, Peoples R China
关键词
Sintering; Dielectric properties; Spinels; Functional applications; LOW SINTERING TEMPERATURES; PHASE-STRUCTURE; SOLID-SOLUTIONS; ZN; EVOLUTION; SYSTEM; CU;
D O I
10.1016/j.ceramint.2013.02.095
中图分类号
TQ174 [陶瓷工业]; TB3 [工程材料学];
学科分类号
0805 ; 080502 ;
摘要
A new high-Q, low-temperature microwave dielectric ceramic with composition Li2Cu0.2Mg0.8Ti3O8 and a cubic spinel structure was prepared at 900-975 degrees C for 2 h by the conventional solid-state route. The ceramic sintered at 950 degrees C for 2 h exhibits optimum dielectric properties with a moderate dielectric constant of 28.1, a high quality factor of 34,300 GHz and a near-zero temperature coefficient of resonance frequency of 9.4 ppm/degrees C. The Li2Cu0.2Mg0.8Ti3O8 ceramic can be compatible with Ag electrode, which makes it a promising ceramic for LTCC technology application. (C) 2013 Elsevier Ltd and Techna Group S.r.l. All rights reserved.
引用
收藏
页码:8503 / 8506
页数:4
相关论文
共 50 条
  • [41] Compatibility with silver electrode and microwave dielectric properties of low firing CaWO4-2Li2WO4 ceramics
    Zhou, Huanfu
    Huang, Jin
    Tan, Xianghu
    Wang, Nan
    Fan, Guangchao
    Chen, Xiuli
    MATERIALS RESEARCH BULLETIN, 2017, 89 : 150 - 153
  • [42] Microwave dielectric properties of the low-temperature-fired Li2ZnTi3O8-Li2TiO3 ceramics for LTCC applications
    Lei, Tong
    Chen, Jiawang
    Xu, Zhiqiang
    Su, Hua
    Li, Yuanxun
    Tang, Xiaoli
    JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2018, 29 (17) : 14705 - 14709
  • [43] Microwave dielectric properties of Ba2Ti3Nb4O18 ceramic doped with ZnO-B2O3-SiO2 glass and its compatibility with silver electrode
    Liu, Xiaobin
    Zhou, Huanfu
    Chen, Xiuli
    Fang, Liang
    JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2012, 23 (02) : 640 - 644
  • [44] Good Thermal Stability, High Permittivity, Low Dielectric Loss and Chemical Compatibility with Silver Electrodes of Low-Fired BaTiO3–Bi(Cu0.75W0.25)O3 Ceramics
    Xiuli Chen
    Dandan Ma
    Jie Chen
    Guisheng Huang
    Huanfu Zhou
    Journal of Electronic Materials, 2017, 46 : 143 - 149
  • [45] Microwave dielectric properties and its compatibility with silver electrode of LiNb0.6Ti0.5O3 with B2O3 and CuO additions
    Xiuli Chen
    Huanfu Zhou
    Liang Fang
    Dongjin Chu
    Changda Li
    Ruili Guo
    Hong Wang
    Journal of Materials Science: Materials in Electronics, 2011, 22 : 371 - 375
  • [46] Microwave dielectric properties and its compatibility with silver electrode of LiNb0.6Ti0.5O3 with B2O3 and CuO additions
    Chen, Xiuli
    Zhou, Huanfu
    Fang, Liang
    Chu, Dongjin
    Li, Changda
    Guo, Ruili
    Wang, Hong
    JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2011, 22 (04) : 371 - 375
  • [47] Good Thermal Stability, High Permittivity, Low Dielectric Loss and Chemical Compatibility with Silver Electrodes of Low-Fired BaTiO3-Bi(Cu0.75W0.25)O3 Ceramics
    Chen, Xiuli
    Ma, Dandan
    Chen, Jie
    Huang, Guisheng
    Zhou, Huanfu
    JOURNAL OF ELECTRONIC MATERIALS, 2017, 46 (01) : 143 - 149
  • [48] Microwave dielectric properties of low-fired ZnNb2O1 ceramics with BiVO4 addition
    Wee, SH
    Kim, DW
    Yoo, SI
    JOURNAL OF THE AMERICAN CERAMIC SOCIETY, 2004, 87 (05) : 871 - 874
  • [49] Microwave dielectric properties of low-fired [Mg0.98(Li0.5Bi0.5)0.02]2SiO4–Ca0.8Sm0.4/3TiO3 composite ceramics
    Simei Zhai
    Peng Liu
    Zhifen Fu
    Journal of Materials Science: Materials in Electronics, 2018, 29 : 1298 - 1303
  • [50] Microwave dielectric properties and low-temperature sintering of (Zn0.8Mg0.2)2SiO4-TiO2 ceramics with Li2O-B2O3
    Zhang, Qi-Long
    Yang, Hui
    Zou, Jia-Li
    JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2009, 20 (02) : 181 - 185