Study on Stress and Reliability of Advanced Intelligent Power Module (IPM) Subjected to Power Cycling

被引：2

作者：

Che, Fa Xing ^{[1
]}

Yamamoto, Kazunori ^{[1
]}

Tang, Gong Yue ^{[1
]}

Ji, Lin ^{[1
]}

机构：

[1] ASTAR, Inst Microelect, 2 Fusionopolis Way,08-02 Innovis Tower, Singapore 138634, Singapore

来源：

2019 IEEE 21ST ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE (EPTC) | 2019年

关键词：

TEMPERATURE;

D O I：

10.1109/eptc47984.2019.9026668

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

In this study, intelligent power module (IPM) with body size of 40mm X 40mm is developed and its stress and reliability are investigated through finite element analysis (FEA) considering power cycling loading condition. Mechanical modeling and simulation for IPM package subjected to power cycling are conducted to help material selection such as epoxy molding compound (EMC), thermal interface material (TIM) and die attach (DA). To improve solder joint reliability and reduce package stress, parametric study on material selection is conducted including 6 EMC, 4 DA, and 4 TIM materials. Final material selection is recommended for IPM test vehicle based on FEA simulation results.

引用

页码：495 / 500

页数：6

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