Substrate integrated waveguides optimized for ultrahigh-speed digital interconnects

被引:47
|
作者
Simpson, Jamesina J. [1 ]
Taflove, Allen
Mix, Jason A.
Heck, Howard
机构
[1] Northwestern Univ, Dept Elect Engn & Comp Sci, Evanston, IL 60208 USA
[2] Intel Corp, Platform Technol Lab, Hillsboro, OR 97124 USA
基金
美国国家科学基金会;
关键词
finite-difference time-domain (FDTD) methods; multiprocessor interconnection; waveguide bends; waveguides;
D O I
10.1109/TMTT.2006.873622
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
This paper reports an experimental and computational study of substrate integrated waveguides (SIWs) optimized for use as ultrahigh-speed bandpass waveguiding digital interconnects. The novelty of this study resides in our successful design, fabrication, and testing of low-loss SlWs that achieve 100% relative bandwidths via optimal excitation of the dominant TE10 mode and avoidance of the excitation of the TE20 mode. Furthermore, our optimal structures maintain their 100% relative bandwidth while transmitting around 45 degrees and 90 degrees bends, and achieve measured crosstalk of better than -30 dB over the entire passband. We consider SlWs operating at center frequencies of 50 GHz, accommodating in principle data rates of greater than 50 Gb/s. These SlWs are 35% narrower in the transverse direction and provide a 20% larger relative bandwidth than our previously reported electromagnetic bandgap waveguiding digital interconnects. Since existing circuit-board technology permits dimensional reductions of the SlWs by yet another factor of 4 : 1 relative to the ones discussed here, bandpass operation at center frequencies approaching 200 GHz with data rates of 200 Gb/s are feasible. These data rates meet or exceed those expected eventually for proposed silicon photonic technologies.
引用
收藏
页码:1983 / 1990
页数:8
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