3D-Stacked Vertical Channel Nonvolatile Polymer Memory

被引:18
|
作者
Hwang, Sun Kak [1 ]
Cho, Suk Man [1 ]
Kim, Kang Lib [1 ]
Park, Cheolmin [1 ]
机构
[1] Yonsei Univ, Dept Mat Sci & Engn, Seoul 120749, South Korea
来源
ADVANCED ELECTRONIC MATERIALS | 2015年 / 1卷 / 1-2期
基金
新加坡国家研究基金会;
关键词
LOW-VOLTAGE; TRANSISTOR MEMORIES; SEMICONDUCTOR; NANOPARTICLES; FILMS;
D O I
10.1002/aelm.201400042
中图分类号
TB3 [工程材料学];
学科分类号
0805 ; 080502 ;
摘要
A 3D-stacked one transistor memory with vertically defined submicrometer channels is realized by carefully designing device architecture involving repetitive deposition of layers in combination with a one-step bilayer transfer of a ferroelectric layer and a semiconducting one. The devices represent a milestone in the realization of mechanically flexible, one-transistor polymer memory with high memory performance.
引用
收藏
页数:7
相关论文
共 50 条
  • [1] MAC: Memory Access Coalescer for 3D-Stacked Memory
    Wang, Xi
    Tumeo, Antonino
    Leidel, John D.
    Li, Jie
    Chen, Yong
    PROCEEDINGS OF THE 48TH INTERNATIONAL CONFERENCE ON PARALLEL PROCESSING (ICPP 2019), 2019,
  • [2] Data Reorganization in Memory Using 3D-stacked DRAM
    Akin, Berkin
    Franchetti, Franz
    Hoe, James C.
    2015 ACM/IEEE 42ND ANNUAL INTERNATIONAL SYMPOSIUM ON COMPUTER ARCHITECTURE (ISCA), 2015, : 131 - 143
  • [3] Smart Memory: Deep Learning Acceleration in 3D-Stacked Memories
    Rezaei, Seyyed Hossein SeyyedAghaei
    Moghaddam, Parham Zilouchian
    Modarressi, Mehdi
    IEEE COMPUTER ARCHITECTURE LETTERS, 2024, 23 (01) : 137 - 141
  • [4] 3D-Stacked memory architectures for multi-core processors
    Loh, Gabriel H.
    ISCA 2008 PROCEEDINGS: 35TH INTERNATIONAL SYMPOSIUM ON COMPUTER ARCHITECTURE, 2008, : 453 - 464
  • [5] Thermal characteristics analysis and optimization of 3D-Stacked Memory Packaging
    Cao, Fengzhe
    Yang, Wen
    Yun, Minghui
    Yang, Daoguo
    2022 19TH CHINA INTERNATIONAL FORUM ON SOLID STATE LIGHTING & 2022 8TH INTERNATIONAL FORUM ON WIDE BANDGAP SEMICONDUCTORS, SSLCHINA: IFWS, 2022, : 121 - 124
  • [6] Ultra-high bandwidth memory with 3D-stacked emerging memory cells
    Abe, Keiko
    Tendulkar, Mihir P.
    Jameson, John R.
    Griffin, Peter B.
    Nomura, Kumiko
    Fujita, Shinobu
    Nishi, Yoshio
    2008 IEEE INTERNATIONAL CONFERENCE ON INTEGRATED CIRCUIT DESIGN AND TECHNOLOGY, PROCEEDINGS, 2008, : 203 - +
  • [7] Investigation of Process -Induced Warpage of 3D-Stacked Memory Packaging
    Tao, Yongqi
    He, Mingzhuang
    Li, Xiaojun
    Su, Xiaoxu
    Cao, Fengzhe
    Yang, Daoguo
    2022 23RD INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY, ICEPT, 2022,
  • [8] Yield Enhancement for 3D-Stacked Memory by Redundancy Sharing across Dies
    Jiang, Li
    Ye, Rong
    Xu, Qiang
    2010 IEEE AND ACM INTERNATIONAL CONFERENCE ON COMPUTER-AIDED DESIGN (ICCAD), 2010, : 230 - 234
  • [9] Heat Dissipation Capability of Package with Integrated Processor and 3D-Stacked Memory
    Han, Yong
    Che, F. X.
    Lim, Sharon Seow Huang
    Kawano, Masaya
    PROCEEDINGS OF THE 2016 IEEE 18TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE (EPTC), 2016, : 813 - 817
  • [10] Accelerating Pointer Chasing in 3D-Stacked Memory: Challenges, Mechanisms, Evaluation
    Hsieh, Kevin
    Khan, Samira
    Vijaykumar, Nandita
    Chang, Kevin K.
    Boroumand, Amirali
    Ghose, Saugata
    Mutlu, Onur
    PROCEEDINGS OF THE 34TH IEEE INTERNATIONAL CONFERENCE ON COMPUTER DESIGN (ICCD), 2016, : 25 - 32