MODERN TENDENCIES IN DEVELOPMENT OF PACKAGING TECHNOLOGIES OF MICROELECTRONICS DEVICES

For satisfaction of modem requirements of the market on functionality, weight and dimension characteristics, reliability, adaptability to manufacture and cost of new products, developers are compelled to project modem electronic equipment with use of microelectronic approaches. New technologies and the corresponding equipment are necessary for maintenance of quality and reliability of let out production. However, the observable tendency of merging of products of microelectronics and radio electronics demands application of complex approaches at carrying out of modernization of the enterprises. The present publication is devoted the organization of modern manufacture capable to deliver tiny electronic devices and components.