Influence of the Thermal Field on Static Behaviour of Sandwich Structures

被引：0
|
作者：
Beznea, Elena-Felicia [1 ]
Coman, Gelu [1 ]
Baroiu, Nicusor [1 ]
Chirica, Ionel [1 ]
机构：
[1] Dunarea de Jos Univ Galati, 47 Domneasca Str, Galati 800008, Romania
来源：
MATERIALE PLASTICE | 2019年 / 56卷 / 01期
关键词：
sandwich panel; finite elements method; thermal analysis; bending analysis; PANELS;
D O I：
暂无
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
In this paper, numerical and experimental studies on the influence of the thermal field on behavior of the structure of sandwich plates in three points bending is analysed. Various materials are used so for skins. For the core only extruded polystyrene, with various thicknesses is used. The thermal conductivity v was determined by using the Hilton B480 unit, based on the heat fiowmeter method described in ISO 8301:1991. We have been analyzed 12 cases of composite sandwich structures. The results obtained by experimental determination and numerical simulation of all cases of modeling are compared and certain differences occurred on the analyzing of influence of the thermal field on the bending characteristics of sandwich structures.
引用
收藏
页码：110 / 114
页数：5
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