Influence of copper on the catalytic carbon nanotube growth process

被引:0
|
作者
Fiedler, Holger [1 ]
Hermann, Sascha [1 ]
Schulz, Stefan E. [1 ]
Gessner, Thomas [1 ]
机构
[1] Tech Univ Chemnitz, Ctr Microtechnol ZFM, D-09126 Chemnitz, Germany
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TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
For Cu/carbon nanotube(CNT) hybrid interconnect technology the growth of CNTs on a conductive substrate connected to Cu lines is required. CNTs were grown by catalytic chemical vapour deposition and the effect of a Cu layer beneath was investigated. By electron energy loss spectroscopy (EELS) we found the Cu to diffuse into the catalyst. This influences CNT growth. Therefore, incorporation of a sufficient diffusion barrier between the Cu layer and the substrate is required. As diffusion barriers we used Ta and TaN.
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页数:3
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