Stress Analysis for SiC Power Devices Packaging by Raman Spectroscopy

被引：0
|
作者：
Uchida, Tomoyuki [1 ]
Sugie, Ryuichi [1 ]
机构：
[1] Toray Res Ctr Ltd, 3-3-7,Sonoyama, Otsu, Shiga, Japan
来源：
2018 13TH INTERNATIONAL MICROSYSTEMS, PACKAGING, ASSEMBLY AND CIRCUITS TECHNOLOGY CONFERENCE (IMPACT) | 2018年
关键词：
DIE ATTACH MATERIALS; SILICON;
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
引用
收藏
页码：293 / 296
页数：4
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