Modeling of epitaxial silicon carbide deposition

被引:18
|
作者
Veneroni, Alessandro [1 ]
Omarini, Fabrizio [1 ]
Moscatelli, Davide [1 ]
Masi, Maurizio [1 ]
Leone, Stefano [2 ]
Mauceri, Marco [2 ]
Pistone, Giuseppe [2 ]
Abbondanza, Giuseppe [2 ]
机构
[1] Politecn Milan, Dipartimento Chim Mat & Ingn Chim Giulio Natta, I-20131 Milan, Italy
[2] Epitaxial Technol Ctr, Catania, Italy
关键词
Fluid flows; Chemical vapor deposition processes; Semiconductor materials; Semiconductor silicon carbide compounds;
D O I
10.1016/j.jcrysgro.2004.10.104
中图分类号
O7 [晶体学];
学科分类号
0702 ; 070205 ; 0703 ; 080501 ;
摘要
The availability of reliable chemical kinetics data is still a key factor in designing epitaxial deposition reactors able to obtain electronic grade surface quality for SiC films. Here, a literature mechanism was considered for the gas phase while a new multi species surface one was introduced. That detailed mechanism was embedded in a series of reactor models of different complexity (1D-3D) to realize a multi hierarchy modeling approach. In the framework of horizontal hot wall reactor with multiwafer rotating susceptor, several process parameters were examined. (C) 2004 Elsevier B.V. All rights reserved.
引用
收藏
页码:E295 / E300
页数:6
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