Identifying best parameters of particleboard bonded with dextrin-based adhesives

The objective of this study was to evaluate the best parameters of particleboard manufacturing throughout the physical and mechanical properties' test under Japanese Industrial Standard. Particleboard panels were manufactured from veneer waste of sengon wood (Paraserianthes moluccana) bonded with dextrin-based adhesives (DAs) and urea formaldehyde (UF) adhesives at the density target of 0.70 g/cm(2) under various manufacturing parameters of adhesives composition, load pressure and pressure temperatures. The results showed that an increase in the value of physical and mechanical properties occurred on particleboards which were glued with DAs added with UF. As the addition of UF adhesive increases, the physical and mechanical properties of the particleboard also gradually increase. This confirms that a good bonding occurs when adding UF adhesives compared to using only dextrin. The particleboard manufacturing parameters demonstrated the best properties when 40% DA was mixed with 60% UF adhesives (DA-UF = 40:60 pbw; P12) for the physical test and 20% DA mixed with 80% UF (DA-UF = 20:80; P13) for the mechanical test for both particleboards under the load pressurized at 40 kgf/cm(2) for 30min at a temperature of 105 degrees C.