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- [21] TSV Density Impact on 3D Power Delivery with High Aspect Ratio TSVs 2013 24TH ANNUAL SEMI ADVANCED SEMICONDUCTOR MANUFACTURING CONFERENCE (ASMC), 2013, : 70 - 74
- [22] Development of high aspect ratio via filling process for 3D packaging application 2010 12TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE (EPTC), 2010, : 762 - 764
- [26] Numerical study of electromagnetic properties of the 3D through silicon via with high aspect ratio METROLOGY, INSPECTION, AND PROCESS CONTROL XXXVII, 2023, 12496
- [27] High Aspect Ratio TSVs in Micropin-Fin Heat Sinks for 3D ICs 2012 12TH IEEE CONFERENCE ON NANOTECHNOLOGY (IEEE-NANO), 2012,
- [28] Pattern Dependent Plasma Charging Effect in High Aspect Ratio 3D NAND Architecture 2016 27TH ANNUAL SEMI ADVANCED SEMICONDUCTOR MANUFACTURING CONFERENCE (ASMC), 2016, : 358 - 360
- [29] Machine learning Assists on High Aspect Ratio Slit Trench Etching in 3D NAND 2022 33RD ANNUAL SEMI ADVANCED SEMICONDUCTOR MANUFACTURING CONFERENCE (ASMC), 2022,