Signal integrity and EMC in high-speed electronic package integration

被引：0
|
作者：
Li, E. P. [1 ]
机构：
[1] Natl Univ Singapore, ASTAR Inst High Performance Comp, Singapore, Singapore
来源：
2007 ASIA-PACIFIC CONFERENCE ON APPLIED ELECTROMAGNETICS, PROCEEDINGS | 2007年
关键词：
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
The increase in functionality and decrease in size of modern electronic products have resulted in the wide applications of high-performance packages using multilayer substrates. The analysis of electrical property including signal integrity and EMI is still the key challenge for such complex package structure. A novel method for system-level modeling of advanced electronic packages is presented which is able to provide fast yet accurate simulation for signal and power integrity analysis of the multilayered electronic packages. The method is a semi- numerical approach based on the combination of the moment method and the scattering matrix method.
引用
收藏
页码：7 / 10
页数：4
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