Wafer Bonding Process Selection

Wafer bonding processes offer valuable solutions not only for MEMS devices but more recently for wafer-level 3D interconnects, advanced packaging and LED applications. The increased complexity of the wafer bonding based applications requires very accurate process design. Unfortunately bonding process selection and design is not always well documented or understood and some important details may not be considered, possibly resulting in major issues during product prototyping or even manufacturing. The main topics to be considered for wafer bonding process selection are summarized and explained.