Challenges of flip chip an organic substrate assembly technology

被引：0
|
作者：
Nagesh, VK [1 ]
Peddada, R [1 ]
Ramalingam, S [1 ]
Sur, B [1 ]
Tai, A [1 ]
机构：
[1] Intel Corp, Assembly Technol Dev, Santa Clara, CA 95052 USA
来源：
49TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE - 1999 PROCEEDINGS | 1999年
关键词：
D O I：
暂无
中图分类号：
TP3 [计算技术、计算机技术];
学科分类号：
0812 ;
摘要：
Flip chip assembly on organic substrate technology has been developed and implemented as a key packaging technology for Intel's microprocessors for cost and performance advantages. In this paper, the process flow, key technology challenges and accomplishments achieved will be addressed. The paper discusses the challenges faced, and their resolution during the development of this key technology that is implemented in high volume manufacturing at Intel.
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收藏
页码：975 / 978
页数：4
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