Limits of hardness at the nanoscale: Molecular dynamics simulations

被引:50
|
作者
Vo, Nhon Q. [1 ]
Averback, Robert S. [1 ]
Bellon, Pascal [1 ]
Caro, Alfredo [2 ]
机构
[1] Univ Illinois, Dept Mat Sci & Engn, Urbana, IL 61801 USA
[2] Lawrence Livermore Natl Lab, Chem Mat & Life Sci Directorate, Livermore, CA 94550 USA
来源
PHYSICAL REVIEW B | 2008年 / 78卷 / 24期
关键词
copper; grain boundaries; grain size; hardening; hardness; molecular dynamics method; nanostructured materials; slip; yield stress;
D O I
10.1103/PhysRevB.78.241402
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
Contrary to the often reported findings from molecular dynamics computer simulation that metals soften as their grain sizes fall below 10-15 nm, we do not observe such softening in nanocrystalline specimens when they are first thermally relaxed. We offer a simple model that illustrates that the increased hardening is a consequence of grain-boundary relaxation, which suppresses grain-boundary sliding and forces the material to deform by dislocation glide. These observations provide an explanation for why some experiments observe an inverse Hall-Petch relationship at grain sizes below 10-20 nm while others do not.
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页数:4
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