A Composite Solder Alloy Preform for High-Temperature Lead-Free Soldering Applications

被引：1
|
作者：
Liu, Weiping [1 ]
Bachorik, Paul [1 ]
Lee, Ning-Cheng [1 ]
机构：
[1] Indium Corp Amer, Clinton, NY USA
来源：
WELDING JOURNAL | 2012年 / 91卷 / 07期
关键词：
D O I：
暂无
中图分类号：
TF [冶金工业];
学科分类号：
0806 ;
摘要：
引用
收藏
页码：50 / 58
页数：9
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