The Signal Integrity of The High-speed IC Design

被引:0
|
作者
Huang, Kaer [1 ]
Liu, Wenyi [1 ]
Zhang, Yan [1 ]
Yan, Hongcheng [1 ]
机构
[1] N Univ China, Natl Key Lab Elect Measurement Technol, Taiyuan, Shanxi, Peoples R China
关键词
signal integrity; termination; high-speed circuit; perfect; routing;
D O I
暂无
中图分类号
TP3 [计算技术、计算机技术];
学科分类号
0812 ;
摘要
With the continuous improvement of the Embedded Microprocessor's main frequency, the signal transmission and processing becoming faster and faster, the traditional method of circuit design and software will not be able to meet the requirements of high-speed circuit design. However, an increasing number of VLSI chips' work frequency has reached above 100MHz, the CPU with 450MHz will also be widely used. The edge of the signal is becoming steeper and steeper (has reached ps), which makes high-speed system design must face a variety of signal integrity issues. This paper presents a number of common signal integrity issues, and the corresponding improvement of the program. In addition, in the premise of that consider signal integrity in the process of high-speed circuit design, given the specific design, given out the solution for important issues of signal integrity that must to consider during the whole process from the schematic diagram design to PCB placement and routing.
引用
收藏
页数:3
相关论文
共 50 条
  • [31] RLC signal integrity analysis of high-speed global interconnects
    Huang, XJ
    Cao, Y
    Sylvester, D
    Lin, S
    King, TJ
    Hu, CM
    INTERNATIONAL ELECTRON DEVICES MEETING 2000, TECHNICAL DIGEST, 2000, : 731 - 734
  • [32] A survey of research method of high-speed interconnect for signal integrity
    Shang Yuling
    Li Yushan
    2006 7TH INTERNATIONAL SYMPOSIUM ON ANTENNAS, PROPAGATION AND EM THEORY, VOLS 1 AND 2, PROCEEDINGS, 2006, : 910 - 913
  • [33] Fast signal separation circuit for a high-speed signal integrity test system
    Nastase, AS
    Nelson, RL
    CAS: 2002 INTERNATIONAL SEMICONDUCTOR CONFERENCE, VOLS 1 AND 2, PROCEEDINGS, 2001, : 377 - 380
  • [34] Effects of Ground Vias on High-Speed Signal Transmission in High-Speed PCB Design
    Li Chunquan
    Kuang Xiaole
    2010 11TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY & HIGH DENSITY PACKAGING (ICEPT-HDP), 2010, : 88 - 91
  • [35] Analysis of signal integrity in high-speed digital IC's, by combining MOSFET modeling and the LE-FDTD method
    Alimenti, F
    Stopponi, G
    Placidi, P
    Ciampolini, P
    Roselli, L
    Sorrentino, R
    2001 IEEE MTT-S INTERNATIONAL MICROWAVE SYMPOSIUM DIGEST, VOLS 1-3, 2001, : 1041 - 1044
  • [36] IC VENDORS ADDRESS NEEDS OF HIGH-SPEED MODEM DESIGN
    MAYER, JH
    COMPUTER DESIGN, 1987, 26 (16): : 78 - &
  • [37] Electrical Interconnect Design for Testing of High-Speed IC Transceivers
    Rimolo-Donadio, R.
    Baks, C.
    Lee, B. G.
    Song, J. H.
    Gu, X.
    Kwark, Y. H.
    Kuchta, D. M.
    Rylyakov, A. V.
    Schow, C. L.
    2012 IEEE 21ST CONFERENCE ON ELECTRICAL PERFORMANCE OF ELECTRONIC PACKAGING AND SYSTEMS, 2012, : 55 - 58
  • [38] SIGNAL-INTEGRITY TOOLS KEEP HIGH-SPEED DESIGNS ON TRACK
    不详
    COMPUTER DESIGN, 1995, 34 (04): : 57 - &
  • [39] A Method for Evaluation on Signal Integrity of SpaceWire High-speed Transmission Network
    Wang, Zhe
    Cui, Bin
    Zhang, Hongwei
    Wang, Wenyan
    2019 PROGNOSTICS AND SYSTEM HEALTH MANAGEMENT CONFERENCE (PHM-PARIS), 2019, : 362 - 367
  • [40] Signal and Power Integrity Analysis of High-Speed Links with Silicon Interposer
    Beyene, Wendemagegnehu
    Juneja, Nitin
    Hahm, Yeon-Chang
    Kollipara, Ravi
    Kim, Joohee
    2017 IEEE 67TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2017), 2017, : 1708 - 1715