Laser-Induced Silver Seeding on Filter Paper for Selective Electroless Copper Plating

被引：3

作者：

Liu, Chang-Chun ^{[1
,2
]}

Cheng, Jin ^{[2
]}

Li, Xiao-Qiang ^{[3
]}

Gu, Zhi-Jie ^{[1
]}

Ogino, Kenji ^{[1
]}

机构：

[1] Tokyo Univ Agr & Technol, Grad Sch Bioapplicat & Syst Engn, Koganei, Tokyo 1848588, Japan

[2] Changzhou Vocat Inst Engn, Coll Chem & Mat Engn, Changzhou 213164, Peoples R China

[3] Jiangnan Univ, Coll Text & Clothing, Wuxi 214122, Peoples R China

来源：

MATERIALS | 2018年 / 11卷 / 08期

基金：

中国博士后科学基金;

关键词：

laser-induced irradiation; flexible printed circuit board; electroless plating; copper pattern; SURFACE; FILMS;

D O I：

10.3390/ma11081348

中图分类号：

O64 [物理化学（理论化学）、化学物理学];

学科分类号：

070304 ; 081704 ;

摘要：

The generation of a flexible printed circuit board on polymer fabrics has been a challenge over the last decade. In this work, a copper pattern was obtained on a soft substrate of filter paper/polyacrylonitrile (FP/PAN) film, where the filter paper was commercially available. The pattern of Ag particles was first produced on an Ag+-doped FP/PAN composite film, followed by electroless plating of copper using the metal silver particles as seeds. The in situ reduction of silver particles and the formation of the silver agglomeration pattern were induced by laser irradiation technology on the FP/PAN/AgNO3 composite film. A variety of characterizations indicated that the resultant copper deposition was uniform, with good conductivity properties.

引用

页数：7

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