Output Power Enhancement of Vertical-Injection Ultraviolet Light-Emitting Diodes by GaN-Free and Surface Roughness Structures

被引:13
|
作者
Lee, C. E. [1 ]
Cheng, B. S.
Lee, Y. C.
Kuo, H. C.
Lu, T. C.
Wang, S. C.
机构
[1] Natl Chiao Tung Univ, Dept Photon, Hsinchu 300, Taiwan
关键词
laser materials processing; light emitting diodes; surface roughness; wafer bonding; LASER LIFT-OFF;
D O I
10.1149/1.3046003
中图分类号
O646 [电化学、电解、磁化学];
学科分类号
081704 ;
摘要
Nitride-based UV, vertical-injection light-emitting diodes (VLEDs) with GaN-free and surface roughness structures operating at 365 nm were proposed and demonstrated by a combination of wafer bonding and laser lift-off processes. The GaN-free structure offers a promising potential for enhancing the light output of UV-VLEDs. The 3.2x light output enhancement was performed by removing the GaN. With the help of adopting a roughened surface, the light-output power of the UV-VLEDs could be further enhanced by a factor of 2.3 as compared with that of UV-VLED without a roughened surface. The total enhancement of surface-roughened GaN-free UV-VLEDs was increased by a factor of 7.8 compared to that of conventional UV-LEDs at a driving current injection of 250 mA.
引用
收藏
页码:H44 / H46
页数:3
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