CPU Experiment of Heat Dissipation and Temperature Rise

被引：0
|
作者：
Li Maode [1 ]
Wei Wei [1 ]
Li Yi [1 ]
机构：
[1] Tongji Univ, Coll Mech Engn, Shanghai 200092, Peoples R China
来源：
2012 7TH INTERNATIONAL CONFERENCE ON SYSTEM OF SYSTEMS ENGINEERING (SOSE) | 2012年
关键词：
CPU; radiator; semiconductor refrigeration type;
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
With the rapid development of computer technology, CPU running speed is becoming higher and higher, the heat dissipation causes a swift advancement of CPU radiators. In order to know more about radiating effect of semiconductor refrigeration, this paper utilizes heating plate as constant heat source to simulate CPU heating. We conducted three kinds of heat dissipation experiments of without any equipment, with fan and with semiconductor refrigeration, which are under the power of 5.5W and 22W. The results indicate that the performance of the semiconductor refrigeration is the best among the three ways. The work provides the experimental base for the further design and theoretical analysis..
引用
收藏
页码：143 / 145
页数：3
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