The distribution of subsurface damage in fused silica

Managing subsurface damage during the shaping process and removing subsurface damage during the polishing process is essential in the production of low damage density optical components, such as those required for use on high peak power lasers. Removal of subsurface damage, during the polishing process, requires polishing to a depth which is greater than the depth of the residual cracks present following the shaping process. To successfully manage, and ultimately remove subsurface damage, understanding the distribution and character of fractures in the subsurface region introduced during fabrication process is important. We have characterized the depth and morphology of subsurface fractures present following fixed abrasive and loose abrasive grinding processes. At shallow depths lateral cracks and an overlapping series of trailing indentation fractures were found to be present. At greater depths, subsurface damage consists of a series of trailing indentation fractures. The area density of trailing fractures changes as a function of depth, however the length and shape of individual cracks remain nearly constant for a given grinding process. We have developed and applied a model to interpret the depth and crack length distributions of subsurface surface damage in terms of key variables including abrasive size and load.