Thermally stable Cu3Sn/Cu composite joint for high-temperature power device

被引：78
|
作者：
Liu, Xiangdong [1 ,2 ]
He, Siliang [1 ,2 ]
Nishikawa, Hiroshi [1 ]
机构：
[1] Osaka Univ, Joining & Welding Res Inst, Osaka 5670047, Japan
[2] Osaka Univ, Grad Sch Engn, Suita, Osaka 5650871, Japan
来源：
SCRIPTA MATERIALIA | 2016年 / 110卷
关键词：
Bonding; Composites; Intermetallic compounds; Sintering; Die attach; LEAD-FREE SOLDERS; CU-SN SYSTEM;
D O I：
10.1016/j.scriptamat.2015.08.011
中图分类号：
TB3 [工程材料学];
学科分类号：
0805 ; 080502 ;
摘要：
This paper describes a novel transient liquid phase sinter (TLPS) bonding that utilizes Sn-coated micro-sized Cu particles for high-temperature power device packaging. When used as die attach materials for Cu-Cu bonding, a thermally stable joint comprising a Cu3Sn intermetallic compounds (IMCs) with a dispersion of ductile Cu particles was obtained after bonding at 300 degrees C for 30s, and a shear strength equivalent to that of conventional Pb-5Sn solder could be achieved. After isothermal aging at 300 degrees C for 200 h, the shear strength and microstructure of the bonding joints were almost unchanged. (C) 2015 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.
引用
收藏
页码：101 / 104
页数：4
相关论文
共 50 条
  • [31] Effects of Cu, Cu3Sn, Cu6Sn5 on Interfacial Properties between Cu-Sn Alloys and Diamond
    Yu, Jianwu
    Huang, Liang
    Wang, Jingchao
    Hu, Zhongxun
    Hai, Yang
    PHYSICA STATUS SOLIDI-RAPID RESEARCH LETTERS, 2022, 16 (07):
  • [32] Effect of Ni on the formation of Cu6Sn5 and Cu3Sn intermetallics
    Yu, Hao
    Vuorinen, Vesa
    Kivilahti, Jorma
    56TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE 2006, VOL 1 AND 2, PROCEEDINGS, 2006, : 1204 - +
  • [33] Preparation, properties, and reliability of Cu/Sn composite joints with porous Cu as interlayer for high-temperature resistant packaging
    Wang, Jianqiang
    Duan, Fangcheng
    Wang, Jintao
    Zhang, Weiwei
    Zhang, Luobin
    Li, Mingyu
    Hang, Chunjin
    Chen, Hongtao
    Liu, Jiahao
    JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2023, 34 (08)
  • [34] Preparation, properties, and reliability of Cu/Sn composite joints with porous Cu as interlayer for high-temperature resistant packaging
    Jianqiang Wang
    Fangcheng Duan
    Jintao Wang
    Weiwei Zhang
    Luobin Zhang
    Mingyu Li
    Chunjin Hang
    Hongtao Chen
    Jiahao Liu
    Journal of Materials Science: Materials in Electronics, 2023, 34
  • [35] On the root cause of Kirkendall voiding in Cu3Sn
    Yin, Liang
    Borgesen, Peter
    JOURNAL OF MATERIALS RESEARCH, 2011, 26 (03) : 455 - 466
  • [36] Assessing the risk of "Kirkendall voiding" in Cu3Sn
    Borgesen, Peter
    Yin, Liang
    Kondos, Pericles
    MICROELECTRONICS RELIABILITY, 2011, 51 (04) : 837 - 846
  • [37] Diffusion growth of Cu3Sn phase in the bump and thin film Cu/Sn structures
    Dimcic, B.
    Labie, R.
    De Messemaeker, J.
    Vanstreels, K.
    Croes, K.
    Verlinden, B.
    De Wolf, I.
    MICROELECTRONICS RELIABILITY, 2012, 52 (9-10) : 1971 - 1974
  • [38] Suppression of Cu3Sn in the Sn-10Cu peritectic alloy by the addition of Ni
    Mehreen, Syeda U. (s.mehreen@uq.edu.au), 1600, Elsevier Ltd (766):
  • [39] On the root cause of Kirkendall voiding in Cu3Sn
    Liang Yin
    Peter Borgesen
    Journal of Materials Research, 2011, 26 : 455 - 466
  • [40] Growth behavior and formation mechanism of porous Cu3Sn in Cu/Sn solder system
    Lin, Ke
    Ling, Huiqin
    Hu, Anmin
    Wu, Yunwen
    Gao, Liming
    Hang, Tao
    Li, Ming
    MATERIALS CHARACTERIZATION, 2021, 178
12345