Thermally stable Cu3Sn/Cu composite joint for high-temperature power device

被引：78
|
作者：
Liu, Xiangdong [1 ,2 ]
He, Siliang [1 ,2 ]
Nishikawa, Hiroshi [1 ]
机构：
[1] Osaka Univ, Joining & Welding Res Inst, Osaka 5670047, Japan
[2] Osaka Univ, Grad Sch Engn, Suita, Osaka 5650871, Japan
来源：
SCRIPTA MATERIALIA | 2016年 / 110卷
关键词：
Bonding; Composites; Intermetallic compounds; Sintering; Die attach; LEAD-FREE SOLDERS; CU-SN SYSTEM;
D O I：
10.1016/j.scriptamat.2015.08.011
中图分类号：
TB3 [工程材料学];
学科分类号：
0805 ; 080502 ;
摘要：
This paper describes a novel transient liquid phase sinter (TLPS) bonding that utilizes Sn-coated micro-sized Cu particles for high-temperature power device packaging. When used as die attach materials for Cu-Cu bonding, a thermally stable joint comprising a Cu3Sn intermetallic compounds (IMCs) with a dispersion of ductile Cu particles was obtained after bonding at 300 degrees C for 30s, and a shear strength equivalent to that of conventional Pb-5Sn solder could be achieved. After isothermal aging at 300 degrees C for 200 h, the shear strength and microstructure of the bonding joints were almost unchanged. (C) 2015 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.
引用
收藏
页码：101 / 104
页数：4
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