High Density 3D Integration

被引：0
|
作者：
Yu, Roy [1 ]
机构：
[1] IBM Corp, TJ Watson Res Ctr, Yorktown Hts, NY 10598 USA
来源：
2008 INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY & HIGH DENSITY PACKAGING, VOLS 1 AND 2 | 2008年
关键词：
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
This paper discusses the current and future needs in continued CMOS scaling, reviews the status of the transfer and joining (TJ) technology for MCM-D and wafer level 3DI integration, and explores the opportunities of the TJ technology in the realm of the "More than Moore" era.
引用
收藏
页码：13 / 22
页数：10
相关论文
共 50 条
  • [31] 3D integration review
    FAROOQ Mukta G.
    IYER Subramanian S.
    Science China(Information Sciences), 2011, 54 (05) : 1012 - 1025
  • [32] Challenges in 3D Integration
    Koyanagi, Mitsumasa
    Lee, Kang Wook
    Fukushima, Takafumi
    Tanaka, Tetsu
    SILICON COMPATIBLE MATERIALS, PROCESSES, AND TECHNOLOGIES FOR ADVANCED INTEGRATED CIRCUITS AND EMERGING APPLICATIONS 3, 2013, 53 (03): : 237 - 244
  • [33] 3D Device Integration
    Bauer, Charles E.
    Neuhaus, Herbert J.
    2009 11TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE (EPTC 2009), 2009, : 427 - 430
  • [34] 3D integration review
    Farooq, Mukta G.
    Iyer, Subramanian S.
    SCIENCE CHINA-INFORMATION SCIENCES, 2011, 54 (05) : 1012 - 1025
  • [35] 3D Integration Technologies
    Ramm, Peter
    Klumpp, Armin
    Weber, Josef
    Taklo, Maaike M. V.
    DTIP 2009: SYMPOSIUM ON DESIGN, TEST, INTEGRATION AND PACKAGING OF MEMS/MOEMS, 2009, : 71 - +
  • [36] 3D FOWLP Integration
    Guan, Lim Teck
    Ho, David Soon Wee
    Chong, Chai Tai
    Bhattacharya, Surya
    2020 IEEE 70TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2020), 2020, : 1728 - 1735
  • [37] Metrology for 3D Integration
    Allen, Richard A.
    Vartanian, Victor H.
    Read, David
    Baylies, Winthrop A.
    INTERNATIONAL SYMPOSIUM ON FUNCTIONAL DIVERSIFICATION OF SEMICONDUCTOR ELECTRONICS 2 (MORE-THAN-MOORE 2), 2014, 61 (06): : 105 - 112
  • [38] 3D monolithic integration
    Batude, P.
    Vinet, M.
    Pouydebasque, A.
    Le Royer, C.
    Previtali, B.
    Tabone, C.
    Hartmann, J. -M.
    Sanchez, L.
    Baud, L.
    Carron, V.
    Toffoli, A.
    Allain, F.
    Mazzocchi, V.
    Lafond, D.
    Deleonibus, S.
    Faynot, O.
    2011 IEEE INTERNATIONAL SYMPOSIUM ON CIRCUITS AND SYSTEMS (ISCAS), 2011, : 2233 - 2236
  • [39] 3D system integration
    Klumpp, Armin
    Merkel, Reinhard
    Ramm, Peter
    Wieland, Robert
    2007 INTERNATIONAL SYMPOSIUM ON VLSI TECHNOLOGY, SYSTEMS AND APPLICATIONS (VLSI-TSA), PROCEEDINGS OF TECHNICAL PAPERS, 2007, : 70 - +
  • [40] 3d integration for introspection
    Mysore, Shashidhar
    Agrawal, Banit
    Srivastava, Navin
    Lin, Sheng-Chih
    Banerjee, Kaustav
    Sherwood, Timothy
    IEEE MICRO, 2007, 27 (01) : 77 - 83
12345