Analysis of stress intensity factor for the cracked film-substrate configuration

This study gives the two problems of a crack in the film oriented perpendicular to the film-substrate interface with the crack tip fully within the film and the crack tip fully within the film. Based on Beuth's theory, three-dimensional model is simplified to plane strain problems, which obtains fracture mechanisms of a cracked film-substrate system by applying the boundary element method, and applies it to evaluate the cracked film-substrate system. It shows that the stress intensity factor(SIF) is affected by the different elastic mismatches and the thickness ratio of the film and the substrate. What's more, this paper studies the special condition of the film-substrate system, which is the analysis of the fracture of the absence of any elastic mismatch between the film and the substrate.