Study on the Growth Mechanism of Intermetallic Compounds in Solid Interface of Aluminum / Steel

被引:0
|
作者
Ma, Hengbo [1 ]
Qiu, Ranfeng [2 ]
Liu, Jiuyong
Zhao, Yangyang
机构
[1] Henan Univ Sci & Technol, Sch Mat Sci & Engn, Luoyang 471003, Peoples R China
[2] Henan Univ Sci & Technol, Henan Key Lab Adv Nonferrous Met, Luoyang 471003, Peoples R China
关键词
explosive welding; aluminum; /; steel; the intermetallic compound; thickness;
D O I
暂无
中图分类号
TE [石油、天然气工业]; TK [能源与动力工程];
学科分类号
0807 ; 0820 ;
摘要
In this experiment, the intermetallic compound of pure aluminum / Q235 low carbon steel was studied by explosive welding. The thickness of IMC in aluminum / steel interface under different heat treatment temperature and heat treatment time was studied. It is found that the thickness of the intermetallic compound layer is different under different holding time, the longer the heating time is, the larger the thickness is. This is because in the constant temperature conditions, although the diffusion coefficient remains unchanged, but with the heating time, atomic diffusion is sufficient to make the intermetallic compound to grow and thicker.
引用
收藏
页码:855 / 858
页数:4
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