Design and Characterization of Electrically Conductive Structures Additively Manufactured by Material Extrusion

被引:48
|
作者
Watschke, Hagen [1 ]
Hilbig, Karl [1 ]
Vietor, Thomas [1 ]
机构
[1] Tech Univ Carolo Wilhelmina Braunschweig, Inst Engn Design, D-38106 Braunschweig, Germany
来源
APPLIED SCIENCES-BASEL | 2019年 / 9卷 / 04期
关键词
3D printing; material extrusion; multi-material additive manufacturing; material characterization; electrical resistivity; heat radiation; FABRICATION; COMPOSITES; FILAMENT; CIRCUITS;
D O I
10.3390/app9040779
中图分类号
O6 [化学];
学科分类号
0703 ;
摘要
Multi-material additive manufacturing offers new design freedom for functional integration and opens new possibilities in innovative part design, for instance, a local integration of electrically conductive structures or heat radiant surfaces. Detailed experimental investigations on materials with three different fillers (carbon black (CB), carbon nanotubes (CNT) and nano copper wires) were conducted to identify process-specific influencing factors on electrical conductivity and resistive heating. In this regard, raster angle orientation, extrusion temperature, speed and flow rate were investigated. A variation of the raster angle (0 degrees, +/- 45 degrees, and 90 degrees) shows the highest influence on resistivity. An angle of 0 degrees had the lowest electrical resistance and the highest temperature increase due to resistive heating. The material filled with nano copper wires showed the highest electrical conductivity followed by the CNT filled material and materials filled with CB. Both current-voltage characteristics and voltage-dependent heat distribution of the surface temperature were determined by using a thermographic camera. The highest temperature increase was achieved by the CNT filled material. The materials filled with CB and nano copper wires showed increased electrical resistance depending on temperature. Based on the experiments, solution principles and design rules for additively manufactured electrically conductive structures are derived.
引用
收藏
页数:25
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