Thermal characterization of carbon-nanofiber-reinforced tetraglycidyl-4,4′-diaminodiphenylmethane/4,4′-diaminodiphenylsulfone epoxy composites

被引:34
|
作者
Xie, HF
Liu, BH
Yang, H
Wang, ZL
Shen, JY
Cheng, RS [1 ]
机构
[1] Nanjing Univ, Coll Chem & Chem Engn, Minist Educ, Key Lab Mesoscop Chem, Nanjing 210093, Peoples R China
[2] S China Univ Technol, Coll Mat Sci & Engn, Guangzhou 510640, Peoples R China
关键词
composites; high performance polymers; thermal properties;
D O I
10.1002/app.23106
中图分类号
O63 [高分子化学(高聚物)];
学科分类号
070305 ; 080501 ; 081704 ;
摘要
The thermal properties of carbon nanofibers (CNF)/epoxy composites, composed of tetraglycidyl-4,4'-diaminodiphenylmethane (TGDDM) resin and 4,4'-diaminodiphenylsulfone (DDS) as a curing agent, were investigated with differential scanning calorimetry (DSC), thermogravimetric analysis, and dynamic mechanical thermal analysis. DSC results showed that the presence of CNF had no pronounced influence on the heat of the cure reaction. However, the incorporation of CNF slightly improved the thermal stability of the epoxy. Furthermore, the storage modulus of the TGDDM/DDS epoxy was significantly enhanced, whereas the glass-transition temperature was not significantly affected, upon the incorporation of CNFs. The storage modulus of 5 wt % CNF/epoxy composites at 25 degrees C was increased by 35% in comparison with that of the pure epoxy. (c) 2006 Wiley Periodicals, Inc.
引用
收藏
页码:295 / 298
页数:4
相关论文
共 50 条
  • [21] RHEOLOGICAL CHARACTERIZATION OF TETRAGLYCIDYL 4,4'-DIAMINODIPHENYLMETHANE META-PHENYLENE DIAMINE SYSTEMS
    IMAZ, JJ
    MARKAIDE, N
    JURADO, MJ
    CORCUERA, MA
    MONDRAGON, I
    EUROPEAN POLYMER JOURNAL, 1992, 28 (03) : 299 - 303
  • [22] Curing kinetics of liquid crystalline 4,4′-Diglycidyloxybiphenyl epoxy cured with 4,4′-Diaminodiphenylsulfone
    Yeo, Hyeonuk
    POLYMER, 2018, 159 : 6 - 11
  • [23] THE MECHANISM OF CURE REACTION OF 4,4'-DIAMINODIPHENYL METHANE WITH TETRAGLYCIDYL 4,4'-DIAMINODIPHENYL METHANE EPOXY
    王维
    吴选征
    漆宗能
    Chinese Journal of Polymer Science, 1992, (01) : 81 - 88
  • [24] The functionalization of carbon nanofibers with 4,4′-diaminodiphenylmethane, a curing agent for epoxy resins
    Chaos-Moran, R.
    Campo, M.
    Prolongo, S. G.
    Escalera, M. D.
    Urena, A.
    JOURNAL OF MATERIALS RESEARCH, 2009, 24 (04) : 1435 - 1445
  • [25] Cure and thermal stability of poly(amide-amidic acid)-cured tetraglycidyl 4,4′-diaminodiphenylmethane
    Chen, Haiming
    Lu, Renguo
    Li, Pei
    Wang, Hongyan
    Huang, Ting
    Huang, Zhongyuan
    Li, Tongsheng
    JOURNAL OF APPLIED POLYMER SCIENCE, 2012, 125 (04) : 2854 - 2860
  • [26] Curing Behavior and Thermal Properties of Trifunctional Epoxy Resin Cured by 4,4′-Diaminodiphenylmethane
    Cheng Jue
    Li Juan
    Yang Wantai
    JOURNAL OF APPLIED POLYMER SCIENCE, 2009, 114 (04) : 1976 - 1983
  • [27] Synthesis and characterization of 4,4′,-diaminodiphenylmethane Schiff bases
    Biricik, Nermin
    Kayan, Cezmi
    ASIAN JOURNAL OF CHEMISTRY, 2007, 19 (03) : 2369 - 2373
  • [29] EPOXY-RESINS BASED ON AROMATIC GLYCIDYLAMINES .6. TOUGHENING OF N,N,N',N'-TETRAGLYCIDYL-4,4'-DIAMINODIPHENYLMETHANE BY REACTIVE ADDITIVES
    DOBAS, I
    LUNAK, S
    ZELENKA, J
    HORALEK, J
    SPACEK, V
    DEPETRIS, S
    JOURNAL OF APPLIED POLYMER SCIENCE, 1992, 45 (05) : 923 - 930
  • [30] Thermal degradation of the polyimide synthesized from 4,4′-(hexafluoroisopropylidene) diphthalic dianhydride and 4,4′-diaminodiphenylmethane
    Ren, Li
    Fu, Weiwen
    Luo, Yuanfang
    Lu, Hui
    Jia, Demin
    Shen, Jiarui
    Pang, Bei
    Ko, Tze-Man
    Journal of Applied Polymer Science, 1600, 91 (04): : 2295 - 2301