Hole mobility and device characteristics of SiGe dual channel structure

被引:6
|
作者
Jung, Jongwan [1 ]
机构
[1] Sejong Univ, Dept Nano Sci & Technol, Seoul 143747, South Korea
关键词
SiGe; Silicon germanium; Mobility; Ge concentration; Biaxial strain; P-TYPE; ELECTRON-MOBILITY; SI1-YGEY;
D O I
10.1016/j.cap.2008.08.020
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
Hole mobility and current-voltage characteristics of p-type MOS transistors with dual channel are examined. High hole mobility needs high Ge compositions in channels (higher than 60% Ge). Besides, hole mobility in alloy channels does not seem much degraded by alloy scattering. Even though high hole mobility could be easily obtained for dual channels with higher than 60% Ge, junction leakage and subthreshold characteristics are severely worsened. These results indicate that there should be a tradeoff between mobility enhancement and the threshold characteristics of p-type MOS transistors for adopting the SiGe dual channel with high Ge composition. (C) 2008 Elsevier B.V. All rights reserved.
引用
收藏
页码:S47 / S50
页数:4
相关论文
共 50 条
  • [1] HIGH HOLE MOBILITY IN SIGE ALLOYS FOR DEVICE APPLICATIONS
    ISMAIL, K
    CHU, JO
    MEYERSON, BS
    APPLIED PHYSICS LETTERS, 1994, 64 (23) : 3124 - 3126
  • [2] Growth of SiGe/Ge/SiGe heterostructures with ultrahigh hole mobility and their device application
    Irisawa, T
    Koh, S
    Nakagawa, K
    Shiraki, Y
    JOURNAL OF CRYSTAL GROWTH, 2003, 251 (1-4) : 670 - 675
  • [3] Investigation on the formation technique of SiGe Fin for the high mobility channel FinFET device
    Zhiqian Zhao
    Xiaohong Cheng
    Yongliang Li
    Ying Zan
    Haoyan Liu
    Guilei Wang
    Anyan Du
    Junjie Li
    Qingzhu Zhang
    Gaobo Xu
    Xueli Ma
    Xiaolei Wang
    Hong Yang
    Jing Xu
    Jun Luo
    JunFeng Li
    Huaxiang Yin
    Wenwu Wang
    Journal of Materials Science: Materials in Electronics, 2020, 31 : 5854 - 5860
  • [4] Investigation on the formation technique of SiGe Fin for the high mobility channel FinFET device
    Zhao, Zhiqian
    Cheng, Xiaohong
    Li, Yongliang
    Zan, Ying
    Liu, Haoyan
    Wang, Guilei
    Du, Anyan
    Li, Junjie
    Zhang, Qingzhu
    Xu, Gaobo
    Ma, Xueli
    Wang, Xiaolei
    Yang, Hong
    Xu, Jing
    Luo, Jun
    Li, JunFeng
    Yin, Huaxiang
    Wang, Wenwu
    JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2020, 31 (08) : 5854 - 5860
  • [5] Thickness Dependence of Hole Mobility in Ultrathin SiGe-Channel p-MOSFETs
    Chleirigh, Cait Ni
    Theodore, N. David
    Fukuyama, H.
    Mure, S.
    Ehrke, H. -Ulrich
    Domenicucci, A.
    Hoyt, Judy L.
    IEEE TRANSACTIONS ON ELECTRON DEVICES, 2008, 55 (10) : 2687 - 2694
  • [6] Hole Mobility in SiGe Inversion Layers: Dependence on Surface Orientation, Channel Direction, and Strain
    Hsieh, Bing-Fong
    Chang, Shu-Tong
    Lee, Ming Hong
    INEC: 2010 3RD INTERNATIONAL NANOELECTRONICS CONFERENCE, VOLS 1 AND 2, 2010, : 606 - +
  • [7] A quantum "hole" is realized by SiGe device
    Yao, L
    2002 IEEE HONG KONG ELECTRON DEVICES MEETING, PROCEEDINGS, 2002, : 99 - 102
  • [8] Impact of strain on hole mobility in the inversion layer of PMOS device with SiGe alloy thin film
    Cheng, S. -Y.
    Chen, K. -T.
    Chang, S. T.
    THIN SOLID FILMS, 2015, 584 : 135 - 140
  • [9] Mobility-limiting mechanisms in single and dual channel strained Si/SiGe MOSFETs
    Olsen, SH
    Dobrosz, P
    Escobedo-Cousin, E
    Bull, SJ
    O'Neill, AG
    MATERIALS SCIENCE AND ENGINEERING B-SOLID STATE MATERIALS FOR ADVANCED TECHNOLOGY, 2005, 124 : 107 - 112
  • [10] Device Characteristics of InGaSb/AlSb High-Hole-Mobility FETs
    Ho, Han-Chieh
    Gao, Zon-Yan
    Lin, Heng-Kuang
    Chiu, Pei-Chin
    Hsin, Yue-Ming
    Chyi, Jen-Inn
    IEEE ELECTRON DEVICE LETTERS, 2012, 33 (07) : 964 - 966