Sustainable manufacturing process for wafer-scale uniform semiconductor nanostructures

被引:0
|
作者
Kim, You Jin [1 ]
Shin, Sang-Ho [1 ]
Zhao, Zhi-Jun [2 ]
Jeong, Jun-Ho [3 ]
Kim, Munho [1 ]
机构
[1] Nanyang Technol Univ, Sch Elect & Elect Engn, Singapore 639798, Singapore
[2] Southwest Jiaotong Univ, Inst Smart City & Intelligent Transport, Chengdu 610032, Peoples R China
[3] Korea Inst Machinery & Mat, Nano Convergence Mech Syst Res Div, Daejeon 34103, South Korea
关键词
D O I
10.1109/NANO54668.2022.9928760
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
In this paper, we report the direct chemisorption-assisted nanotransfer method based on the melting point lowering effect. This transfer method provides the efficient transfer printing of metal template layers onto 6-in wafer scale with excellent uniformity without using chemical adhesive layers. We further demonstrate the fabrication of silicon nanowire photodetectors with high aspect ratio by metal assisted chemical etching. Our results provide an unprecedented nanofabrication approach for next-generation applications such as energy harvesting, optoelectronics, and photonic devices.
引用
收藏
页码:435 / 438
页数:4
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