CMP service for prototyping and low volume production

CMP aims at providing Universities, Research Laboratories and Industries with the possibility to have their integrated circuits projects fabricated for prototyping and low volume production. Presently, users are serviced for CMOS double layer poly/double layer metal (DLP/DLM) 0.8, DLM/TLM 0.6 mu, DLP/4LM 0.35 mu, SLP/6LM 0.18 mu, SLP/6LM 0.13 mu, SLP/7LM 90nm, BiCMOS DLP/DLM 0.8 mu,, SiGe 0.35 mu SLP/5LM, SiGe:C 0.25 mu SLP/5LM and GaAs HEMT 0.2 mu. About 40 multi-project runs are offered per year. Micro Electro Mechanical Systems (MEMS) are also provided in standard CMP runs in CMOS DLP/DLM 0.8 mu 0.6 mu, BiCMOS DLP/DLM 0.8 mu and HEMT GaAs 0.2 mu, using compatible front-side bulk micro-machining. MUMPS processes are offered as surface micro-machining allowing integrating MEMS only microstructures.